3U - Enterprise Server (Dual CPU)

CPU:
Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Cores:
Up to 64 Cores
Chipset:
System on Chip

Memory Capacity:
16 DIMM slots
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
Memory Type:
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes:
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Rackmount Chassis

17.72” x 17.24” x 5.15”

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

BIOS Type:
AMI 256Mb SPI Flash EEPROM
BIOS Features:
Plug and Play (PnP)
DMI 2.3
PCI 2.2
ACPI 6.2
USB Keyboard Support
SMBIOS 3.1.1

SATA:
SATA3 (6 Gbps)
IPMI:
Support for Intelligent Platform Management Interface v. 2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2600 BMC
Network Controllers:
Dual LAN via Broadcom BCM57416 10GBase-T Ethernet Controller
VGA:
ASPEED AST2600 BMC

6x 2.5" Hot-swap HDD bays

8x Full Height ( 3 x Double-width GPGPU )

1600W Redundant PSU

On board I/O
SATA:
10 SATA3 (6 Gbps) ports
LAN:
2x 10GBase-T LAN ports
1 RJ45 Dedicated IPMI LAN port
USB:
2 USB 2.0 ports (rear)
4 USB 3.0 ports (2 rear, 2 headers)
VGA:
1 VGA port
Others:
1 COM port (rear)
2 SATA DOM power connectors
4 PCI-E 4.0 NVMe x4 internal ports
TPM 2.0 header

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

CPU:
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Cores / Cache:
Up to 28 cores
Note:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Memory Capacity:
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes:
RDIMM: 64GB
LRDIMM: 128GB
3DS LRDIMM: 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Rackmount Chassis

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

BIOS Type:
AMI UEFI

Chipset:
Intel® C621
SATA:
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2500
Network Controllers:
Dual LAN with 1GbE LAN with Intel® X722
Graphics:
ASPEED AST2500 BMC

6x 2.5" Hot-swap HDD bays

8 x Full Height ( 3 x Double-width GPGPU )

1600W Redundant PSU

SATA:
14x SATA3 (6Gbps) port
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
4x USB 2.0 ports (2x rear + 2x via headers)
5x USB 3.2 Gen1 ports (2x rear + 2x via headers + 1x Type A)
Video Output:
1x VGA port
Serial Port / Header:
2x COM Ports (1x rear, 1x header)
TPM:
1x TPM Header

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

CPU:
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core:
Up to 40 cores

Memory Capacity:
18 DIMM slots
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz
Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz
P1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
Memory Type:
3200/2933/2666MHz ECC 3DS DDR4 LRDIMM, RDIMM
DIMM Sizes:
LRDIMM: 256GB
RDIMM: 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

2U Rackmount Chassis

17.72” x 17.24” x 5.15”

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

BIOS Type:
AMI UEFI

Chipset:
Intel® C621A
SATA:
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2600 BMC
Network Controllers:
Dual LAN with Intel® i350 Gigabit Ethernet Controller

6x 2.5" Hot-swap HDD bays

8x Full Height ( 3 x Double-width GPGPU )

1600W Redundant PSU

SATA:
14x SATA3 (6Gbps) port(s)
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
7x USB 3.2 Gen1 port(s) (2x via header; 4x rear; 1x type A)
2x USB 2.0 port(s) (2x via header)
Video Output:
2x VGA (1x rear bezel, 1x front panel) port(s)
Serial Port:
2x COM Port(s) (1x header; 1x rear)
TPM:
1x TPM Header

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

CPU:
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
Core:
Up to 28 cores
Note:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Memory Capacity:
16 DIMM slots
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, DDR4-2666MHz
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
LRDIMM: 128GB
RDIMM: 64GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Chassis

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel:
System power on/off
System reset
2x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

Chipset:
Intel® C621
SATA:
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2500
Graphics:
ASPEED AST2500 BMC
Network Controllers:
Dual LAN with 1GbE LAN with Intel® X722

Drive Bays
External: 
16x 3.5" hot swap
2x 2.5" hot swap rear
Internal:
2x 2.5 Internal
Backplane
1x 16-port 12Gb SATA/SAS backplane with 28-PHY expander chip and 3 SFF-8643 connectors

7 slots

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

3x 80x38mm PWM & low-power consumption hot swap fans

CPU:
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core:
Up to 40 cores

Memory Capacity:
18 DIMM slots
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz
Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz
P1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
Memory Type:
3200/2933/2666MHz ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
LRDIMM: 256GB
RDIMM: 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Chassis

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel:
System power on/off
System reset
2x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

BIOS Type:
AMI UEFI

Chipset:
Intel® C621A
SATA:
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2600 BMC
Network Controllers:
Dual LAN with Intel® i350 Gigabit Ethernet Controller

Drive Bays
External:
16x 3.5" hot swap
2x 2.5" rear hot swap
Internal
4x 2.5” internal
Backplane
1x 16-port 12Gb SATA/SAS backplane with 28-PHY expander chip and 3 SFF-8643 connectors

7x low profile

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

Onboard Input / Output
SATA:
14x SATA3 (6Gbps) port(s)
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
7x USB 3.2 Gen1 port(s) (2 via header; 4 rear; 1 type A)
2x USB 2.0 port(s) (2 via header)
Video Output:
2x VGA (1 rear bezel, 1 front panel) port(s)
Serial Port:
2x COM Port(s) (1 header; 1 rear)
TPM:
1x TPM Header

3x 80x38mm PWM & low-power consumption hot swap fans