ARS-111GL-DNHR-LCC

$104,155.00

SKU	ARS-111GL-DNHR-LCC

Processor

(per Node)
CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Note:
Supports up to 2000W TDP CPUs (Liquid Cooled)

GPU
Max GPU Count:
Up to 1 onboard GPU
Supported GPU:
NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
View GPU Options
CPU-GPU Interconnect:
NVLink®-C2C
GPU-GPU Interconnect:
PCIe

Memory

Slot Count: Onboard Memory
Max Memory: Up to 480GB ECC LPDDR5X
Additional GPU Memory: Up to 96GB ECC HBM3

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.75" (44 mm)
Width:
17.33" (440 mm)
Depth:
37" (940 mm)

Bios	BIOS Type: AMI 64MB SPI Flash EEPROM

HDD Drive Bays

Default:
Total 4 bays
4 front hot-swap E1.S NVMe drive bays

M.2:
2 M.2 NVMe slots (M-key)

Expansion Slots

Default
2 PCIe 5.0 x16 FHFL slots

Power Supply

2x 2700W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL):
73.5 x 40 x 185 mm

Input:
2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)

+12V:
Max: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)

12V SB:
Max: 4A / Min: 0A

Output Type:
Backplanes (gold finger)

Input Output

(per Node)
LAN:
1 RJ45 1 GbE Dedicated BMC LAN port
USB:
2 ports(rear)
Video:
1 mini-DP port

Cooling

Fans:
7 Removable heavy-duty 4cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

Details

Management
Power configurations:
Power-on mode for AC power recovery
ACPI Power Management

PC Health Monitoring
CPU:
Monitors for CPU Cores, Chipset Voltages, Memory
FAN:
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors

ARS-111GL-NHR

$52,780.00

CONFIGURE

SKU	ARS-111GL-NHR

Processor

CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note:
Supports up to 1000W TDP CPUs (Air Cooled)

Memory

Slot Count: Onboard Memory
Max Memory: Up to 480GB ECC LPDDR5X
Additional GPU Memory: Up to 96GB ECC HBM3

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43.6 mm)
Width:
17.26" (438.4 mm)
Depth:
35.4" (900 mm)

Front Panel

Buttons:
Power On/Off button

Bios	BIOS Type: AMI 64MB SPI Flash EEPROM

HDD Drive Bays

Drive Bays Configuration:
Default: Total 8 bays
8 front hot-swap E1.S NVMe drive bays

M.2:
2 M.2 NVMe slots (M-key)

Expansion Slots

Default
2 PCIe 5.0 x16 FHFL slots

Power Supply

2x 2000W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL):
73.5 x 40 x 185 mm

Input:
1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vac / 50-60Hz
2000W: 230-240Vdc / 50-60Hz (for CQC only)

+12V:

Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)

12V SB:
Max: 3.5A / Min: 0A

Output Type:
Backplanes (gold finger)

Input Output

LAN:
1 RJ45 1 GbE Dedicated BMC LAN port

USB:
1 USB 3.0 port(Rear)

Video:
1 mini-DP port

TPM:
1 TPM Onboard/port 80

Cooling

Fans:
9 Removable heavy-duty 4cm Fan(s)

Operating Environment

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

Details

Management
Power configurations:
Power-on mode for AC power recovery
ACPI Power Management

PC Health Monitoring
CPU:
Monitors for CPU Cores, Chipset Voltages, Memory
FAN:
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors

SYS-120C-TR

Please Inquire

CONFIGURE

SKU	SYS-120C-TR

Processor

CPU:
Dual Socket P4 (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count:
Up to 40C/80T; Up to 60MB Cache per CPU
Note:
Supports up to 270W TDP CPUs (Air Cooled)

Air Cooled CPUs with TDP over 185W only supported under specific conditions. Contact a our representative for details.

Max GPU Count:
Up to 2 double-width or 2 single-width GPU(s)
Supported GPU:
NVIDIA PCIe: A2
Certification:
Nvidia Certified

Memory

Memory:
Memory Capacity: 16 DIMM slots
Up to 4TB: 16x 256 GB DRAM
Up to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem
Memory Type: 3200MHz ECC DDR4 RDIMM;LRDIMM;PMEM
Intel® Optane™ persistent memory 200 series
Memory Voltage:
1.2 V
Error Detection:
ECC

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
23.5" (597mm)

Front Panel

Buttons:
Power On/Off button
Unit Identification (UID) button
LEDs:
HDD activity LED
Network Activity LEDs
Power status LED
Unit Identification (UID) LED

Bios	BIOS Type: AMI 32MB SPI FLASH ROM

Onboard Devices

SATA:
SATA3 (6Gbps); RAID 0/1/5/10 support
Chipset:
Intel® C621A
Network Connectivity:
with Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network Card(s) under Optional Parts List for options)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
8x 2.5" hot-swap SATA/SAS drive bays
M.2:
2x PCIe 3.0 x2
M-Key, 2280
Peripheral Bays:
1 DVD slot drive bays (optional)

Expansion Slots

2 PCIe 4.0 x16 FHHL slot(s)

Power Supply

860W Redundant Platinum Level power supplies
Dimension (W x H x L):
54.5 x 40.25 x 322 mm
AC Input:
800W: 100-127Vac
800W: 100-127Vac / 50-60Hz
860W: 200-240Vac
860W: 200-240Vdc / 50-60Hz
860W: 200-240Vac / 50-60Hz
+12V:
Max: 66.6A / Min: 0A (100Vac-127Vac)
Max: 71.6A / Min: 0A (200Vdc-240Vdc)
Max: 71.6A / Min: 0A (200Vac-240Vac)
5V SB:
Max: 4A / Min: 0A
Output Type:
Backplanes (gold finger)
Certification:
Platinum Level Certified

Input Output

LAN:
1 Dedicated IPMI LAN port
USB:
2 USB 3.0 port(s) (2 rear)
Video:
1 VGA port(s)
Serial Port:
1 COM Port(s) (1 rear)
DOM:
1 SuperDOM (Disk on Module) port

Cooling

Fans:
6x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

SYS-120H-TNR

Please Inquire

CONFIGURE

SKU	SYS-120H-TNR

Processor

CPU:
Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count:
Up to 40C/80T; Up to 60MB Cache per CPU
Note:
Supports up to 270W TDP CPUs (Air Cooled)

Max GPU Count:
Up to 2 double-width GPU(s)

Memory

Memory:
Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Up to 12TB: 16x 512 GB PMem and 16x 256 GB DRAM
Memory Type: 3200MHz ECC DDR4
Intel® Optane™ persistent memory 200 series
Memory Voltage:
1.2 V
Error Detection:
ECC

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
29.4" (747mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
Power
System information

Bios	BIOS Type: AMI 256MB SPI Flash

Onboard Devices

SATA:
SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe:
NVMe; RAID 0/1/5/10 support (Intel® VROC RAID key required)
Chipset:
Intel® C621A
Network Connectivity:
2x 1GbE BaseT with Intel® i350-AM2 (optional)
4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
2x 10GbE BaseT with Intel® X550-AT2 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
8x 2.5" hot-swap NVMe/SATA/SAS drive bays (8x 2.5" NVMe hybrid) (Configurable option for 12x 2.5" hot-swap NVMe/SAS/SATA drive bays. NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)
M.2:
2 M.2 NVMe OR 2 M.2 SATA3
M-Key, 2280/2210

Expansion Slots

1 PCIe 4.0 x16 FH, 6.6"L slot(s)

2 PCIe 4.0 x16 FH, 10.5"L slot(s)

Power Supply

2x 1200W Redundant Titanium Level power supplies
Dimension (W x H x L):
73.5 x 40 x 265 mm
AC Input:
800W: 100-127Vac / 50-60Hz
1200W: 200-240Vac / 50-60Hz
1200W: 230-240Vdc / 50-60Hz (for CCC only)
+12V:
Max: 66.7A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vac-240Vac)
Max: 100A / Min: 0A (230Vdc-240Vdc) (for CCC only)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
Backplanes (gold finger)
Certification:
Titanium Level

Input Output

LAN:
1 RJ45 Dedicated BMC LAN port
USB:
3 USB 3.0 port(s) (1 front; 2 rear)
Video:
1 VGA port(s)

Cooling

Fans:
8x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

SYS-120U-TNR

Please Inquire

CONFIGURE

SKU	SYS-120U-TNR

Processor

CPU:
Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count:
Up to 40C/80T; Up to 60MB Cache per CPU
Note:
Supports up to 270W TDP CPUs (Air Cooled)

Max GPU Count:
Up to 2 double-width or 2 single-width GPU(s)
Supported GPU:
NVIDIA PCIe: A100, A16, A2, T4
View Complete List

Memory

Memory:
Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Up to 12TB: 16x 512 GB PMem and 16x 256 GB DRAM
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
Memory Voltage:
1.2 V
Error Detection:
ECC

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
29.1" (739mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
Power status
System information (overheat/UID)

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

SATA:
SATA3 (6Gbps) via Intel® PCH 621A; RAID 0/1/5/10 support
NVMe:
NVMe (16GT/s); RAID 0/1/5/10 support
Chipset:
Intel® C621A
Network Connectivity:
2x 10GbE BaseT with Intel® X710-AT2 (optional) OR
2x 10GbE BaseT and 2x 10GbE SFP+ with Intel® X710-TM4 (optional)
No NIC option supported
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

12x 2.5" hot-swap NVMe/SATA/SAS drive bays (12x 2.5" NVMe hybrid) (SAS/NVMe support requires additional parts. Please contact us for details.)

Expansion Slots

1 PCIe 4.0 x16 Internal LP slot(s)
1 PCIe 4.0 x16 LP slot(s)
2 PCIe 4.0 x16 FH, 10.5"L slot(s)

Power Supply

1200W Redundant Titanium Level power supplies
Dimension (W x H x L):
73.5 x 40 x 203 mm
AC Input:
800W: 100-127Vac / 50-60Hz
1200W: 200-240Vac / 50-60Hz
1200W: 200-240Vdc / 50-60Hz (for CCC only)
+12V:
Max: 66.7A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vdc-240Vdc)
Max: 100A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
Backplanes (gold finger)
Certification:
Titanium Level

Input Output

LAN:
1 RJ45 Dedicated BMC LAN port
USB:
3 USB 3.0 port(s) (1 front; 2 rear)
Video:
1 VGA port(s)
Serial Port:
1 COM Port(s) (1 rear)
DOM:
2 SuperDOM (Disk on Module) port

Cooling

Fans:
8x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

SYS-610C-TR

Please Inquire

CONFIGURE

SKU	SYS-610C-TR

Processor

CPU:
Dual Socket P4 (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count:
Up to 40C/80T; Up to 60MB Cache per CPU
Note:
Supports up to 270W TDP CPUs (Air Cooled)
Air Cooled CPUs with TDP over 185W only supported under specific conditions. Contact a our representative for details.

Max GPU Count:
Up to 2 double-width or 2 single-width GPU(s)
Supported GPU:
NVIDIA PCIe: A2

Memory

Memory:
Memory Capacity: 16 DIMM slots
Up to 4TB: 16x 256 GB DRAM
Up to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem
Memory Type: 3200MHz ECC DDR4 RDIMM;LRDIMM;PMEM
Intel® Optane™ persistent memory 200 series
Memory Voltage:
1.2 V
Error Detection:
ECC

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
25.6" (650mm)

Front Panel

Buttons:
Power On/Off button
System Reset button
Unit Identification (UID) button
LEDs:
Fan Fail/System Over Heat LED
HDD activity LED
Network Activity LEDs
Power status LED
Unit Identification (UID) LED

Bios	BIOS Type: AMI 32MB SPI FLASH ROM

Onboard Devices

SATA:
SATA3 (6Gbps); RAID 0/1/5/10 support
Chipset:
Intel® C621A
Network Connectivity:
with Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network Card(s) under Optional Parts List for options)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
4x 3.5" hot-swap SATA/SAS drive bays (Default 3.5" drive trays can also support 2.5" drives.)
M.2:
2x PCIe 3.0 x2
M-Key, 2280
Peripheral Bays:
2x 2.5" 7mm fixed drive bays (optional)

Expansion Slots

2 PCIe 4.0 x16 FHHL slot(s)

Power Supply

860W Redundant Platinum Level power supplies
Dimension (W x H x L):
54.5 x 40.25 x 322 mm
AC Input:
800W: 100-127Vac
800W: 100-127Vac / 50-60Hz
860W: 200-240Vac
860W: 200-240Vdc / 50-60Hz
860W: 200-240Vac / 50-60Hz
+12V:
Max: 66.6A / Min: 0A (100Vac-127Vac)
Max: 71.6A / Min: 0A (200Vdc-240Vdc)
Max: 71.6A / Min: 0A (200Vac-240Vac)
5V SB:
Max: 4A / Min: 0A
Output Type:
Backplanes (gold finger)
Certification:
Platinum Level Certified

Input Output

LAN:
1 Dedicated IPMI LAN port
USB:
2 USB 3.0 port(s) (2 rear)
Video:
1 VGA port(s)
Serial Port:
1 COM Port(s) (1 rear)
DOM:
1 SuperDOM (Disk on Module) port

Cooling

Fans:
6x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

SYS-610U-TNR

Please Inquire

CONFIGURE

SKU	SYS-610U-TNR

Processor

CPU:
Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count:
Up to 40C/80T; Up to 60MB Cache per CPU
Note:
Supports up to 270W TDP CPUs (Air Cooled)

Max GPU Count:
Up to 2 double-width or 2 single-width GPU(s)
Supported GPU:
NVIDIA PCIe: A100, A16, RTX A4000, A2, A30, T4

Memory

Memory:
Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Up to 12TB: 16x 512 GB PMem and 16x 256 GB DRAM
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
Memory Voltage:
1.2 V
Error Detection:
ECC

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
29.7" (754mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
LAN2 acticity
Power status
System information (overheat/UID)

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

SATA:
SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe:
NVMe (16GT/s); RAID 0/1/5/10 support
Chipset:
Intel® C621A
Network Connectivity:
2x 10GbE BaseT with Intel® X710-AT2 (optional) OR
2x 10GbE BaseT and 2x 10GbE SFP+ with Intel® X710-TM4 (optional)
No NIC option supported
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

4x 3.5" hot-swap NVMe/SATA/SAS drive bays (4x 2.5" NVMe hybrid) (SAS/NVMe support requires additional parts. Please see the Optional Parts list.)

Expansion Slots

1 PCIe 4.0 x16 Internal LP slot(s)
1 PCIe 4.0 x16 LP slot(s)
2 PCIe 4.0 x16 FH, 10.5"L slot(s)

Power Supply

1200W Redundant Titanium Level power supplies
Dimension (W x H x L):
73.5 x 40 x 203 mm
AC Input:
800W: 100-127Vac / 50-60Hz
1200W: 200-240Vac / 50-60Hz
1200W: 200-240Vdc / 50-60Hz (for CCC only)
+12V:
Max: 66.7A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vdc-240Vdc)
Max: 100A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
Backplanes (gold finger)
Certification:
Titanium Level

Input Output

LAN:
1 RJ45 Dedicated BMC LAN port
USB:
2 USB 3.0 port(s) (2 rear)
Video:
1 VGA port(s)
Serial Port:
1 COM Port(s) (1 rear)
DOM:
2 SuperDOM (Disk on Module) port

Cooling

Fans:
8x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

1U - GPU Server

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