RM31616-H12SSL-NT

$2,194.00

SKU	RM31616-H12SSL-NT

Processor

CPU:
Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Cores:
Up to 64 Cores
Chipset:
System on Chip

Memory

Memory Capacity:
8 DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
Memory Type:
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes:
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

Chassis

3U Rackmount Chassis

Dimensions

D x W x H
655.3 x 432 x 132 (mm)
27.8” x 17” x 5.2”

Front Panel

1x Power On/Off
1x Alarm Mute
1x System Reset
2x USB2.0/ USB3.0 (Option)

Bios	BIOS Type: AMI 256Mb SPI Flash EEPROM BIOS Features: Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1.1

Onboard Devices

SATA:
SATA3 (6 Gbps)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2500 BMC
Network Controllers:
Dual 10GBase-T LAN via Broadcom BCM57416
1 Realtek RTL8211F PHY (dedicated IPMI)
VGA:
ASPEED AST2500 BMC

HDD Drive Bays

16x 3.5" Hot-swap HDD bays

Expansion Slots

7 x Full Height and Full Length

Power Supply

875W redundant PSU

Input Output

onboard I/O
SATA/NVMe Hybrid:
2x SlimSAS x8 (each: 8 SATA3 or 2 NVMe)
LAN:
Dual 10GBase-T LAN ports
1x RJ45 Dedicated IPMI LAN port
USB:
6x USB 3.0 ports
(4 rear + 2 via header)
VGA:
1x VGA port
Others:
1x COM port (rear)
1x TPM 2.0 header

Cooling

4 x 80mm Fan, 4P4C, T38, Two Ball Bearing, L90mm, Hot-swap, w/Holder

Operating Environment

Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

RM35206-H12SSL-i

$1,918.00

CONFIGURE

SKU	RM35206-H12SSL-i

Processor

CPU:
Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Cores:
Up to 64 Cores
Chipset:
System on Chip

Memory

Memory Capacity:
8x DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
Memory Type:
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes:
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

Chassis

3U Rackmount Chassis

Dimensions

D x W x H
450.0 x 438.0 x 131.0 mm
17.72” x 17.24” x 5.15”

Front Panel

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

Bios	BIOS Type: AMI 256Mb SPI Flash EEPROM BIOS Features: Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1.1

Onboard Devices

SATA:
SATA3 (6 Gbps)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2500 BMC
Network Controllers:
Dual gigabit LAN via Broadcom BCM5720
1 Realtek RTL8211F PHY (dedicated IPMI)
VGA:
ASPEED AST2500 BMC

HDD Drive Bays

6x 2.5" Hot-swap HDD bays

Expansion Slots

8 x Full Height ( 3 x Double-width GPGPU )

Power Supply

1600W Redundant PSU

Input Output

onboare IO

SATA:

8x SATA3 (6 Gbps) ports

SATA/NVMe Hybrid

8x SATA3 or 2 NVMe via single SlimSAS x8

LAN:

2x RJ45 Gigabit Ethernet LAN ports

1x RJ45 Dedicated IPMI LAN port

USB:

6x USB 3.0 ports

(4 rear + 2 via header)

VGA:

1x VGA port

Others:

1x COM port (rear)

2x SATA DOM power connectors

1x TPM 2.0 header

Cooling

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

Operating Environment

Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

RM35206-H12SSL-NT

$2,035.00

CONFIGURE

SKU	RM35206-H12SSL-NT

Processor

CPU:
Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Cores:
Up to 64 Cores
Chipset:
System on Chip

Memory

Memory Capacity:
8 DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
Memory Type:
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes:
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

Chassis

3U Rackmount Chassis

Dimensions

D x W x H
450.0 x 438.0 x 131.0 mm
17.72” x 17.24” x 5.15”

Front Panel

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

Bios	BIOS Type: AMI 256Mb SPI Flash EEPROM BIOS Features: Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1.1

Onboard Devices

SATA:
SATA3 (6 Gbps)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2500 BMC
Network Controllers:
Dual 10GBase-T LAN via Broadcom BCM57416
1 Realtek RTL8211F PHY (dedicated IPMI)
VGA:
ASPEED AST2500 BMC

HDD Drive Bays

6x 2.5" Hot-swap HDD bays

Expansion Slots

8 x Full Height ( 3 x Double-width GPGPU )

Power Supply

1600W Redundant PSU

Input Output

onboard I/O
SATA/NVMe Hybrid:
2x SlimSAS x8 (each: 8 SATA3 or 2 NVMe)
LAN:
Dual 10GBase-T LAN ports
1x RJ45 Dedicated IPMI LAN port
USB:
6x USB 3.0 ports
(4 rear + 2 via header)
VGA:
1x VGA port
Others:
1x COM port (rear)
1x TPM 2.0 header

Cooling

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

Operating Environment

Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

RSC-3ET-X12SPL-F

$2,225.00

CONFIGURE

SKU	RSC-3ET-X12SPL-F

Processor

CPU:
3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Core:
Up to 40 cores

Memory

Memory Capacity:
8 DIMM slots
Up to 2TB Intel® Optane™ Persistent Memory 200 Series
Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz
Memory Type:
3200/2933/2666MHz ECC , DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors

Chassis

3U Chassis

Dimensions

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel

Front Panel:
System power on/off
System reset
2 x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

Bios	BIOS Type: AMI UEFI BIOS Features: ACPI 6.2 SMBIOS 3.0 or later UEFI 2.7

Onboard Devices

Chipset:
Intel® C621A
SATA:
Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2600 BMC
Graphics:
ASPEED AST2600 BMC
Network Controllers:
Dual LAN with Intel® i210 Gigabit Ethernet Controller

HDD Drive Bays

Drive Bays
External:
16x 3.5” hot swap
2x 2.5” hot swap
Internal:
4x 2.5” internal
Backplane
1x 16-port 12Gb SATA/SAS backplane with 28-PHY expander chip and 3 SFF-8643 connectors

Expansion Slots

7 low profile

Power Supply

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

Input Output

Onboard Input / Output
SATA
10x SATA3 (6Gbps) port(s)
LAN
2x RJ45 Gigabit Ethernet LAN ports
USB
6x USB 2.0 port(s) (4 via header; 2 rear)
5x USB 3.2 Gen1 port(s) (2 via header; 2 rear; 1 type A)
Video Output
1x VGA port(s)
Serial Port
1x COM Port(s) (1 header)
DOM
2x SATA DOM (Disk on Module) power connector support
TPM
1x TPM Header

Cooling

3x 80x38mm PWM & low-power consumption hot swap fans

Operating Environment

Operating Temperature Range:
0°C - 50°C (32°F - 122°F)
Non-Operating Temperature Range:
-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range:
10% - 85% (non-condensing)
Non Operating Relative Humidity Range:
10% - 95% (non-condensing)

3U - Entry Level Servers (Single-CPU)

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