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2U - SuperMicro Intel Xeon Scalable Servers

 
Results For: 2U - SuperMicro Intel Xeon Scalable Servers
  • SSG-221E-NE324R
    SSG-221E-NE324R
    Please Inquire
    CONFIGURE
    SKU
    SSG-221E-NE324R 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Note:
    Supports 145W - 350W TDP CPUs (Air Cooled)
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (89.8 mm)
    Width:
    17.2" (438.4 mm)
    Depth:
    30.8" (789.9 mm)
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    Via AIOM

    NVMe
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 24 bay(s)
    24 front hot-swap E3.S 1T NVMe drive bay(s)

    M.2:
    2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    4 PCIe 5.0 x8 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option A
    2 PCIe 5.0 x8 FHHL slot(s)
    1 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option B
    2 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
     
    Power Supply
    1x 2000W Redundant Titanium Level power supply
    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    +12V:
    Max: 166A / Min: 0A (230Vac-240Vac)

    12V SB:
    Max: 3.5A

    AC Input:
    2000W: 230-240Vdc / 50-60Hz (for China only)

    Output Type:
    Backplanes (gold finger)
     
    Cooling
    4 Heavy Duty 8cm Fan(s)
     
    Operating Environment
    ROHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (Non-Condensing)
    Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
     
  • SSG-521E-E1CR24H
    SSG-521E-E1CR24H
    Please Inquire
    CONFIGURE
    SKU
    SSG-521E-E1CR24H 
    Processor
    CPU：
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count：
    Up to 36C/72T; Up to 180MB Cache

    Note：
    Supports 120W - 300W TDP CPUs (Air Cooled)
     
    Memory
    Memory:
    Slot Count: 16 DIMM slots
    Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5"
    Width:
    17.2"
    Depth:
    34"
     
    Front Panel
    LED:
    Network activity
    Power status
    SSD activity
    System information (overheat/UID) 

    Buttons:
    Power On/Off 
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    Via AIOM
     
    HDD Drive Bays
    Drive Bays Configuration
    Default: Total 26 bays
    12 front hot-swap 3.5" SAS/SATA drive bays
    12 top-loading hot-swap 3.5" SAS/SATA drive bays
    2 rear hot-swap 2.5" SATA drive bays
     
    Option A: Total 28 bays
    12 front hot-swap 3.5" SAS/SATA drive bays
    12 top-loading hot-swap 3.5" SAS/SATA drive bays
    2 rear hot-swap 2.5" SATA drive bays
    2 rear hot-swap 2.5" NVMe drive bays
     
    Option B: Total 30 bays
    12 front hot-swap 3.5" SAS/SATA drive bays
    12 top-loading hot-swap 3.5" SAS/SATA drive bays
    4 rear hot-swap 2.5" NVMe drive bays
    2 rear hot-swap 2.5" SATA drive bays
    View NVMe Options
    View Drive Options
     
    M.2:
    2 M.2 NVMe/SATA slots (M-key 2280/22110)
     
    Expansion Slots
    Default
    4 PCIe 5.0 x8 FHHL slots
    2 PCIe 5.0 x16 FHHL slots
    1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    Option A
    2 PCIe 5.0 x8 FHHL slots
    2 PCIe 5.0 x16 FHHL slots
    1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    Option B
    2 PCIe 5.0 x16 FHHL slots
    2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible)
     
    Power Supply
    2x 1600W Redundant Titanium Level (96%) Hot-plug power supplies
    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    Input:
    1000W: 100-127Vac
    1000W: 100-127Vac / 50-60Hz
    1600W: 200-240Vac
    1600W: 200-240Vac / 50-60Hz

    +12V:
    Max: 83.3A / Min: 0A (100Vac-127Vac)
    Max: 83A / Min: 0A (100Vac-127Vac)
    Max: 133A / Min: 0A (200Vac-240Vac)

    12V SB:
    Max: 2.1A / Min: 0A

    Output Type:
    Backplanes (gold finger)

    Certification:
    Titanium Level
     
    Input Output
    LAN:
    1 RJ45 1 GbE Dedicated BMC LAN port

    USB:
    2 USB 3.0 ports(rear)

    Video:
    1 VGA port

    DOM:
    2 SuperDOM (Disk on Module) ports
     
    Cooling
    Fans:
    4 Heavy Duty 8cm Fan(s)

    Air Shroud:
    1 Air Shroud
     
    Operating Environment
    ROHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature: 10°C to 35°C (50°F to 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (Non-Condensing)
    Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
     
    Details
    Management
    Software:
    SuperCloud Composer®
    Supermicro Server Manager (SSM)
    Supermicro Update Manager (SUM)
    Supermicro SuperDoctor® 5 (SD5)
    Super Diagnostics Offline (SDO)
    Supermicro Thin-Agent Service (TAS)
    SuperServer Automation Assistant (SAA) New!
    Power configurations:
    Power-on mode for AC power recovery
    ACPI Power Management

    Security
    Hardware:
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features:
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    Supply Chain Security: Remote Attestation
    Runtime BMC Protections
    System Lockdown

    PC Health Monitoring
    CPU:
    Monitors for CPU Cores, Chipset Voltages, Memory
    7 Phase-switching voltage regulator
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • SYS-211E-FRDN2T
    SYS-211E-FRDN2T
    $3,142.00
    CONFIGURE
    SKU
    SYS-211E-FRDN2T 
    Processor
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 60C/120T; Up to 112.5MB Cache

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 205W only supported under specific conditions.
     
    Memory
    Memory:
    Slot Count: 8 DIMM slots
    Max Memory (2DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88.9mm)
    Width:
    17.2" (436.88mm)
    Depth:
    11.8" (298.8mm)
     
    Front Panel
    Buttons:
    Power On/Off 
    UID button

    LEDs:
    HDD activity
    LAN1 activity
    LAN2 activity
    Power status
    System information
     
    Bios
    BIOS Type:
    AMI 256MB SPI Flash
     
    Onboard Devices
    NVMe:
    NVMe; RAID 0/1 support (Intel® VROC RAID Key required)

    Chipset:
    Intel® C741

    Network Connectivity:
    2x 100GbE QSFP28 with Intel® E810-CAM2 (optional)
    2x 25GbE QSFP28 with Intel® XXV710 (optional)
    2x 25GbE QSFP28 with Intel® E810-CAM1 (optional)
    2x 40GbE QSFP+ with Intel® XL710-BM2 (optional)
    2x 10GbE SFP+ with Intel® X710-BM2 (optional)
    4x 1GbE BaseT with Intel® i350 (optional)
    2x 200GbE QSFP56 with Mellanox® MT28908A0-XCCF-HVM (optional)
    2x 10GbE BaseT with Intel® X550

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    2x 2.5" hot-swap NVMe drive bays (2x 2.5" NVMe dedicated)
    M.2:
    2 M.2 NVMe
    M-Key, 2280/22110
     
    Expansion Slots
    1 PCIe 5.0 x16 HHHL slot(s)
    1 PCIe 5.0 x8 HHHL slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    1U 600W Redundant short depth DC48V input redundant power supply
    Total Output Power：
    600W : (-44) - (-65) Vdc

    Dimension (W x H x L)：
    54.5 x 40 x 220 mm

    +12V：
    Max: 50A

    5V SB：
    Max: 3A / Min: 0A
     
    Input Output
    LAN：
    1 RJ45 Dedicated BMC LAN port
    2 RJ45 10GbE (Intel® X550-AT2)

    USB：
    2 USB 2.0 port(s) (2 front)
    2 USB 3.0 port(s) (2 front)

    Video：
    1 VGA port(s)

    Serial Port：
    1 COM Port(s) (1 front)
     
    Cooling
    Fans:
    4x 4-PIN PWM 8cm Fan(s)
     
    Operating Environment
    Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
     
    Details
    Management
    Software:
    SUM
    SSM
    Redfish API
    IPMI 2.0
    Intel® Node Manager
    SPM
    KVM with dedicated LAN
    NMI
    Watch Dog
    SuperDoctor® 5
    IPMI 2.0
    Power Configurations:
    ACPI Power Management
     
  • SYS-211E-FRN2T
    SYS-211E-FRN2T
    $3,050.00
    CONFIGURE
    SKU
    SYS-211E-FRN2T 
    Processor
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 60C/120T; Up to 112.5MB Cache

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 205W only supported under specific conditions.
     
    Memory
    Memory:
    Slot Count: 8 DIMM slots
    Max Memory (2DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88.9mm)
    Width:
    17.2" (436.88mm)
    Depth:
    11.8" (298.8mm)
     
    Front Panel
    Buttons:
    Power On/Off 
    UID button

    LEDs:
    HDD activity
    LAN1 activity
    LAN2 activity
    Power status
    System information
     
    Bios
    BIOS Type:
    AMI 256MB SPI Flash
     
    Onboard Devices
    NVMe:
    NVMe; RAID 0/1 support (Intel® VROC RAID Key required)

    Chipset:
    Intel® C741

    Network Connectivity:
    2x 25GbE QSFP28 with Intel® XXV710 (optional)
    2x 25GbE QSFP28 with Intel® E810-CAM1 (optional)
    2x 40GbE QSFP+ with Intel® XL710-BM2 (optional)
    2x 10GbE SFP+ with Intel® X710-BM2 (optional)
    4x 1GbE BaseT with Intel® i350 (optional)
    2x 200GbE QSFP56 with Mellanox® MT28908A0-XCCF-HVM (optional)
    2x 10GbE BaseT with Intel® X550
    2x 100GbE QSFP28 with Intel® E810-CAM2 (optional)

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    2x 2.5" hot-swap NVMe drive bays (2x 2.5" NVMe dedicated)

    M.2:
    2 M.2 NVMe
    M-Key, 2280/22110
     
    Expansion Slots
    1 PCIe 5.0 x16 HHHL slot(s)
    1 PCIe 5.0 x8 HHHL slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    800W Redundant AC 100-240V Power Supplies with PMBus
    Dimension (W x H x L):
    54.5 x 40 x 220 mm
     
    Input Output
    LAN:
    1 RJ45 Dedicated BMC LAN port
    2 RJ45 10GbE (Intel® X550-AT2)

    USB:
    2 USB 2.0 port(s) (2 front)
    2 USB 3.0 port(s) (2 front)

    Video:
    1 VGA port(s)

    Serial Port:
    1 COM Port(s) (1 front)
     
    Cooling
    4x 4-PIN PWM 8cm Fan(s)
     
    Operating Environment
    Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
     
    Details
    Management
    Software:
    SUM
    SSM
    Redfish API
    IPMI 2.0
    Intel® Node Manager
    SPM
    KVM with dedicated LAN
    NMI
    Watch Dog
    SuperDoctor® 5
    IPMI 2.0
    Power Configurations:
    ACPI Power Management
     
  • SYS-211GT-HNC8F
    SYS-211GT-HNC8F
    Please Inquire
    CONFIGURE
    SKU
    SYS-211GT-HNC8F 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
    Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)​

    Core Count:
    Up to 64C/128T; Up to 320MB Cache

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
     
    Memory
    (per Node)
    Memory:
    Slot Count: 16 DIMM slots/2 Channels
    Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chasis
     
    Dimensions
    Height:
    3.46" (88mm)
    Width:
    17.67" (449mm)
    Depth:
    28" (711.2mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button
    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
    (per Node)
    SAS:
    SAS3 (12Gbps) via Broadcom® 3808 (IT mode)
    Chipset:
    Intel® C741
    Network Connectivity:
    Via IO Module
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Hot-swap:
    4x 2.5" hot-swap NVMe/SATA/SAS drive bays (4x 2.5" NVMe dedicated)
    M.2:
    2 M.2 NVMe OR 2 M.2 SATA3
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x16 slot(s)
     
    Power Supply
    Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus
    Dimension (W x H x L):
    106 x 84 x 245 mm

    AC Input:
    100-127Vdc (1200W for the Rest of the World)
    200-220Vdc (1800W for the Rest of the World)
    200-220Vdc (2090W for North America - UL & cUL)
    220-230Vdc (1980W for the Rest of the World)
    220-240Vdc (2200W for North America - UL & cUL)
    230-240Vdc (2090W for the Rest of the World)

    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port
    USB:
    2 USB 3.0 port(s) (2 USB)
    Video:
    1 VGA port(s)
     
    Cooling
    2x 16.5K RPM Heavy Duty 8cm Fan(s)
    2x 16K RPM Heavy Duty 8cm Fan(s)
     
    Operating Environment
    RoHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (Non-Condensing)
    Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)
     
  • SYS-211GT-HNC8R
    SYS-211GT-HNC8R
    $8,333.00
    CONFIGURE
    SKU
    SYS-211GT-HNC8R 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 320MB Cache

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 350W only supported under specific conditions. 
     
    Memory
    (per Node)
    Memory:
    Slot Count: 16 DIMM slots/2 Channels
    Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.46" (88mm)
    Width:
    17.67" (449mm)
    Depth:
    28" (711.2mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button

    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
    SAS:
    SAS3 (12Gbps) via Broadcom® 3808 (IT mode)
    Chipset:
    Intel® C741
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Hot-swap:
    6x 2.5" hot-swap NVMe/SATA/SAS drive bays (6x 2.5" NVMe dedicated)
    M.2:
    2 M.2 NVMe OR 2 M.2 SATA3
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    2 PCIe 5.0 x16 slot(s)
     
    Power Supply
    Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus
    Dimension (W x H x L):
    106 x 84 x 245 mm
    AC Input:
    100-127Vdc (1200W for the Rest of the World)
    200-220Vdc (1800W for the Rest of the World)
    200-220Vdc (2090W for North America - UL & cUL)
    220-230Vdc (1980W for the Rest of the World)
    220-240Vdc (2200W for North America - UL & cUL)
    230-240Vdc (2090W for the Rest of the World)
    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port
    USB:
    2 USB 3.1 port(s) (2 USB)
    Video:
    1 VGA port(s)
     
    Cooling
    2x 16.5K RPM Heavy Duty 8cm Fan(s)
    2x 16K RPM Heavy Duty 8cm Fan(s)
     
    Operating Environment
    RoHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (Non-Condensing)
    Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)
     
  • SYS-211GT-HNTF
    SYS-211GT-HNTF
    $8,052.00
    CONFIGURE
    SKU
    SYS-211GT-HNTF 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
    Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)​

    Core Count:
    Up to 64C/128T; Up to 320MB Cache

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
     
    Memory
    (per Node)
    Memory:
    Slot Count: 16 DIMM slots/2 Channels
    Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.46" (88mm)
    Width:
    17.67" (449mm)
    Depth:
    28" (711.2mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button
    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
     (per Node)
    Chipset:
    Intel® C741
    Network Connectivity:
    Via IO Module
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Hot-swap:
    4x 2.5" hot-swap NVMe/SATA drive bays (4x 2.5" NVMe dedicated)
    M.2:
    2 M.2 NVMe OR 2 M.2 SATA3
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x16 slot(s)
     
    Power Supply
    Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus
    Dimension (W x H x L):
    106 x 84 x 245 mm
    AC Input:
    100-127Vdc (1200W for the Rest of the World)
    200-220Vdc (1800W for the Rest of the World)
    200-220Vdc (2090W for North America - UL & cUL)
    220-230Vdc (1980W for the Rest of the World)
    220-240Vdc (2200W for North America - UL & cUL)
    230-240Vdc (2090W for the Rest of the World)
    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port
    USB:
    2 USB 3.0 port(s) (2 USB)
    Video:
    1 VGA port(s)
     
    Cooling
    2x 16.5K RPM Heavy Duty 8cm Fan(s)
    2x 16K RPM Heavy Duty 8cm Fan(s)
     
    Operating Environment
    RoHS:
    RoHS Compliant
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (Non-Condensing)
    Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)
     
  • SYS-211GT-HNTR
    SYS-211GT-HNTR
    $7,767.00
    CONFIGURE
    SKU
    SYS-211GT-HNTR 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 300MB Cache

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 350W only supported under specific conditions.
     
    Memory
    (per Node)
    Memory:
    Slot Count: 16 DIMM slots/2 Channels
    Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.46" (88mm)
    Width:
    17.67" (449mm)
    Depth:
    28" (711.2mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button
    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
    (per Node)
    Chipset:
    Intel® C741
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Hot-swap:
    6x 2.5" hot-swap NVMe/SATA drive bays (6x 2.5" NVMe dedicated)
    M.2:
    2 M.2 NVMe OR 2 M.2 SATA3
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    2 PCIe 5.0 x16 slot(s)
     
    Power Supply
    Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus
    Dimension (W x H x L):
    106 x 84 x 245 mm

    AC Input:
    100-127Vdc (1200W for the Rest of the World)
    200-220Vdc (1800W for the Rest of the World)
    200-220Vdc (2090W for North America - UL & cUL)
    220-230Vdc (1980W for the Rest of the World)
    220-240Vdc (2200W for North America - UL & cUL)
    230-240Vdc (2090W for the Rest of the World)

    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port
    USB:
    2 USB 3.1 port(s) (2 USB)
    Video:
    1 VGA port(s)
     
    Cooling
    2x 16.5K RPM Heavy Duty 8cm Fan(s)
    2x 16K RPM Heavy Duty 8cm Fan(s)
     
    Operating Environment
    RoHS:
    RoHS Compliant
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (Non-Condensing)
    Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)
     
  • SYS-211SE-31A
    SYS-211SE-31A
    $4,559.00
    CONFIGURE
    SKU
    SYS-211SE-31A 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 52C/104T; Up to 97.5MB Cache

    Note:
    Supports 85W - 300W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 205W only supported under specific conditions. 
     
    Memory
    (per Node)
    Memory:
    Slot Count: 8 DIMM slots/1 Channels
    Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88mm)
    Width:
    17.7" (449mm)
    Depth:
    16.9" (430mm)
     
    Front Panel
    Buttons:
    Power On/Off 
    UID button
    LEDs:
    LAN1 activity
    Power status
    System information
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    1x 1GbE BaseT port(s)

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Drive Bays:
    N/A

    M.2:
    2 M.2 NVMe
    M-Key, 2280/22110
     
    Expansion Slots
    (per Node)
    1 PCIe 5.0 x16 LP slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    2000W Redundant AC 100-240V Power Supply
    Dimension:
    (W x H x L) 73.5 x 40 x 265 mm

    AC Input:
    1000W: 100-127Vac / 9A-12A / 50-60Hz
    1800W: 200-220Vac / 9.8A-10A / 50-60Hz
    2000W: 220-240Vac / 10A-11A / 50-60Hz

    +12V:
    Max: 83A / Min: 0A (100Vac-127Vac)
    Max: 150A / Min: 0A (200Vac-220Vac)
    Max: 166A / Min: 0A (220Vac-240Vac)
     
    Input Output
    LAN:
    1 RJ45 GbE LAN port (shared with IPMI)

    Video:
    1 VGA port(s)

    Serial Port:
    1 COM Port(s) (1 COM)

    Others:
    1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
     
    Cooling
    Air Shroud:
    3 Air Shroud(s)

    Fans:
    12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
     
    Operating Environment
    Environmental Spec.
    Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
     
     
    Note:
    Operating Temperature (CPU TDP up to 300W) : Continuous 0°C to 35°C (32°F to 95°F)
    Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 40°C (32°F ~ 104°F), Short term -5°C ~ 55°C (23°F ~ 131°F)
     
    Details
    Management
    Software:
    SuperDoctor® 5
    IPMI 2.0
    Power Configurations:
    ACPI Power Management
    Power-on mode for AC power recovery
     
  • SYS-211SE-31AS
    SYS-211SE-31AS
    $4,669.00
    CONFIGURE
    SKU
    SYS-211SE-31AS 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 52C/104T; Up to 97.5MB Cache

    Note:
    Supports 85W - 300W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 205W only supported under specific conditions.
     
    Memory
    (per Node)
    Memory:
    Slot Count: 8 DIMM slots/1 Channels
    Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88mm)
    Width:
    17.7" (449mm)
    Depth:
    16.9" (430mm)
     
    Front Panel
    Buttons:
    Power On/Off 
    UID button
    LEDs:
    LAN1 activity
    Power status
    System information
     
    Onboard Devices
    (per Node)
    Chipset:
    Intel® C741

    Network Connectivity:
    1x 1GbE SFP

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
     (per Node)
    Drive Bays:
    N/A

    M.2:
    2 M.2 NVMe
    M-Key, 2280/22110
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x16 LP slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    2000W Redundant AC 100-240V Power Supply
    Dimension (W x H x L):
    73.5 x 40 x 265 mm

    AC Input:
    1000W: 100-127Vac / 9A-12A / 50-60Hz
    1800W: 200-220Vac / 9.8A-10A / 50-60Hz
    2000W: 220-240Vac / 10A-11A / 50-60Hz

    +12V:
    Max: 83A / Min: 0A (100Vac-127Vac)
    Max: 150A / Min: 0A (200Vac-220Vac)
    Max: 166A / Min: 0A (220Vac-240Vac)
     
    Input Output
    LAN:
    1 SFP GbE LAN port (Shared NIC

    Video:
    1 VGA port(s)

    Serial Port:
    1 COM Port(s) (1 COM)

    Others:
    1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
     
    Cooling
    Air Shroud:
    3 Air Shroud(s)
     

    Fans:
    12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)

    Note:
    Operating Temperature (CPU TDP up to 300W) : Continuous0°C to 35°C (32°F to 95°F)
    Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 35°C (32°F ~ 95°F), Short term -5°C ~ 55°C (23°F ~ 131°F)
     
    Details
    Management
    Software:
    SuperDoctor® 5
    IPMI 2.0
    Power Configurations:
    ACPI Power Management
    Power-on mode for AC power recovery
     
  • SYS-211SE-31D
    SYS-211SE-31D
    $4,550.00
    CONFIGURE
    SKU
    SYS-211SE-31D 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 52C/104T; Up to 97.5MB Cache

    Note:
    Supports 85W - 300W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 205W only supported under specific conditions. 
     
    Memory
    (per Node)
    Memory:
    Slot Count: 8 DIMM slots/1 Channels
    Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88mm)
    Width:
    17.7" (449mm)
    Depth:
    16.9" (430mm)
     
    Front Panel
    Buttons:
    Power On/Off 
    UID button
    LEDs:
    LAN1 activity
    Power status
    System information
     
    Onboard Devices
    (per Node)
    Chipset:
    Intel® C741

    Network Connectivity:
    1x 1GbE BaseT port(s)

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Drive Bays:
    N/A

    M.2:
    2 M.2 NVMe
    M-Key, 2280/22110
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x16 LP slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    2000W Redundant DC -48V Power Supplies with PMBus
    Total Output Power:
    2000W : (-44) - (-60) Vdc
    Dimension (W x H x L):
    73.5 x 40 x 265 mm
    +12V:
    Max: 166.6A
    12V SB:
    Max: 4A
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 GbE LAN port (shared with IPMI)
    Video:
    1 VGA port(s)
    Serial Port:
    1 COM Port(s) (1 COM)
    Others:
    1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
     
    Cooling
    Air Shroud:
    3 Air Shroud(s)

    Fans:
    12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)

    Note:
    Operating Temperature (CPU TDP up to 300W) : Continuous 0°C to 35°C (32°F to 95°F)
    Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 40°C (32°F ~ 104°F), Short term -5°C ~ 55°C (23°F ~ 131°F)
     
    Details
    Management
    Software:
    SuperDoctor® 5
    IPMI 2.0
    Power Configurations:
    ACPI Power Management
    Power-on mode for AC power recovery
     
  • SYS-211SE-31DS
    SYS-211SE-31DS
    $4,500.00
    CONFIGURE
    SKU
    SYS-211SE-31DS 
    Processor
    (per Node)
    CPU:
    Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 52C/104T; Up to 97.5MB Cache

    Note:
    Supports 85W - 300W TDP CPUs (Air Cooled)
    Air Cooled CPUs with TDP over 205W only supported under specific conditions. 
     
    Memory
    (per Node)
    Memory:
    Slot Count: 8 DIMM slots/1 Channels
    Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88mm)
    Width:
    17.7" (449mm)
    Depth:
    16.9" (430mm)
     
    Front Panel
    Buttons:
    Power On/Off 
    UID button

    LEDs:
    LAN1 activity
    Power status
    System information
     
    Onboard Devices
    (per Node)
    Chipset:
    Intel® C741

    Network Connectivity:
    1x 1GbE SFP

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Drive Bays:
    N/A

    M.2:
    2 M.2 NVMe
    M-Key, 2280/22110
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x16 LP slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    2000W Redundant DC -48V Power Supplies with PMBus
    Total Output Power:
    2000W : (-44) - (-60) Vdc

    Dimension (W x H x L):
    73.5 x 40 x 265 mm

    +12V:
    Max: 166.6A

    12V SB:
    Max: 4A
     
    Input Output
    (per Node)
    LAN:
    1 SFP GbE LAN port (shared with IPMI)

    Video:
    1 VGA port(s)

    Serial Port:
    1 COM Port(s) (1 COM)

    Others:
    1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
     
    Cooling
    Air Shroud:
    3 Air Shroud(s)

    Fans:
    12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)

    Note:
    Operating Temperature (CPU TDP up to 300W) : Continuous 0°C to 35°C (32°F to 95°F)
    Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 40°C (32°F ~ 104°F), Short term -5°C ~ 55°C (23°F ~ 131°F)
     
    Details
    Management
    Software:
    SuperDoctor® 5
    IPMI 2.0
    Power Configurations:
    ACPI Power Management
    Power-on mode for AC power recovery
     
  • SYS-220HE-FTNR
    SYS-220HE-FTNR
    Please Inquire
    CONFIGURE
    SKU
    SYS-220HE-FTNR 
    Processor
    Processor
    CPU：
    Dual Socket P+ (LGA-4189)
    3rd Gen Intel® Xeon® Scalable processors
    Note：
    Supports up to 270W TDP CPUs (Air Cooled)

    GPU
    Max GPU Count：
    Up to 3 double-width or 3 single-width GPU(s)
    Supported GPU：
    NVIDIA PCIe: T4, A40, A100, A10
    CPU-GPU Interconnect：
    PCIe 4.0 x16 CPU-to-GPU Interconnect
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
    Memory Voltage:
    1.2V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88.9 mm)
    Width:
    17.2" (436.88 mm)
    Depth:
    22.6" (574 mm)
     
    Front Panel
    LED:
    HDD activity LED
    LAN1 activity
    LAN2 activity
    Power Fail
    Power status LED
    System information

    Buttons:
    Power On/Off 
    UID button
     
    Onboard Devices
    SATA:
    SATA (6Gbps) ; RAID 0/1/5/10 support

    NVMe:
    NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)

    Chipset:
    Intel® C621A

    Network Connectivity:
    2 RJ45 1GbE with Intel® I350-AM2 (optional)
    4 SFP 1GbE with Intel® I350-AM4 (optional)
    2 RJ45 10GBASE-T with Intel® X550-AT2 (optional)
    2 SFP+ 10GbE with Intel® X710-BM2 (optional)
    4 SFP+ 10GbE with Intel® XL710-BM1 (optional)
    4 SFP+ 10GbE with Intel® X710-TM4 (optional)
    2 SFP28 25GbE with Broadcom® BCM57414 (optional)
    4 SFP28 25GbE (optional)
    2 QSFP28 100GbE with Broadcom® BCM57508 (optional)
    4 RJ45 1GbE with Intel® I350-AM4 (optional)

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 6 bay(s)
    6 front hot-swap 2.5" NVMe/SAS/SATA drive bay(s)

    M.2:
    2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
     
    Expansion Slots
    Default:
    3 PCIe 4.0 x16 FHFL slot(s)
    1 PCIe 4.0 x16 FHHL slot(s)
    Option A:
    6 PCIe 4.0 x8 (in x16) FHFL slot(s)
    2 PCIe 4.0 x8 (in x16) FHHL slot(s)
     
    Power Supply
    2000W Redundant Titanium (certification pending) Level power supplies

    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    +12V:
    Max: 83A (100Vac-127Vac)
    Max: 150A (200Vac-220Vac)
    Max: 165A (220Vac-230Vac)
    Max: 166A (230Vac-240Vac)

    12V SB:
    Max: 3.5A

    AC Input:
    1000W: 100-127Vac / 50-60Hz
    1800W: 200-220Vac / 50-60Hz
    1980W: 220-230Vac / 50-60Hz
    2000W: 220-240Vac / 50-60Hz (for UL only)
    2000W: 230-240Vac / 50-60Hz
    2000W: 230-240Vdc / 50-60Hz (for China only)

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    LAN:
    1 RJ45 1 GbE Dedicated BMC LAN port(s)

    USB:
    2 USB 2.0 port(s) (front)

    Video:
    1 VGA port(s)
     
    Cooling
    6 Counter-rotating, Hot-swappable 60x60x56mm Fan(s)
     
    Operating Environment
    Operating Temperature: 5°C ~ 35°C (41°F ~ 95°F)
    Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity: 8% to 90% (non-condensing)
    Non-operating Relative Humidity: 5% to 95% (non-condensing)
     
    Details
    Security
    Hardware:
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features:
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    System Lockdown

    PC Health Monitoring
    CPU:
    Monitors for CPU Cores, Chipset Voltages, Memory
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • SYS-220U-TNR
    SYS-220U-TNR
    $6,080.00
    CONFIGURE
    SKU
    SYS-220U-TNR 
    Processor
    Processor
    CPU:
    Dual Socket P+ (LGA-4189)
    3rd Gen Intel® Xeon® Scalable processors
    Core Count:
    Up to 40C/80T; Up to 60MB Cache per CPU
    Note:
    Supports up to 270W TDP CPUs (Air Cooled)

    GPU
    Max GPU Count:
    Up to 4 double-width or 6 single-width GPU(s)
    Supported GPU:
    NVIDIA PCIe: T4, RTX A6000, RTX A5000, A40, A30, A16, A2, A100, A10
    View GPU Options
    Certification:
    NVIDIA CERTIFIED
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
    Supports Intel® Optane™ persistent memory 200 series

    Memory Voltage:
    1.2V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (89 mm)
    Width:
    17.2" (437 mm)
    Depth:
    28.2" (717.2 mm)
     
    Front Panel
    LED:
    HDD activity
    LAN1 activity
    LAN2 acticity
    Power Fail
    Power status
    System information (overheat/UID) 

    Buttons:
    Power On/Off 
    UID button
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    SATA:
    SATA (6Gbps) ; RAID 0/1/5/10 support

    NVMe:
    NVMe; RAID 0/1/5/10 support

    Chipset:
    Intel® C621A

    Network Connectivity:
    2 RJ45 10GBASE-T with Intel® X710-AT2 (optional)
    2 RJ45 10GBASE-T with Intel® X710-TM4 (optional)
    2 SFP+ 10GbE with Intel® X710-TM4 (optional)
    No NIC option supported

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Default: Total 24 bay(s)
    22 front hot-swap 2.5" NVMe/SAS/SATA drive bay(s)
    2 front hot-swap 2.5" SAS*/SATA drive bay(s)
    (SAS support may require additional storage controller and/or cables)
     
    Expansion Slots
    1 PCIe 4.0 x16 FH/10.5″L slot(s)
    5 PCIe 4.0 x8 FH/10.5″L slot(s)
    1 PCIe 4.0 x8 LP slot(s)
    1 PCIe 4.0 x16 LP slot(s)
     
    Power Supply
    1600W Redundant Titanium Level Hot-plug power supplies
    Dimension (WxHxL)：
    73.5 x 40 x 203 mm

    +12V：
    Max: 83.3A / Min: 0A (100Vac-127Vac)
    Max: 133A / Min: 0A (200Vac-240Vac)

    12V SB：
    Max: 2.1A / Min: 0A

    AC Input：
    1000W: 100-127Vac / 50-60Hz
    1600W: 200-240Vac / 50-60Hz

    Output Type：
    Backplanes (gold finger)

    Certification：
    Titanium Level
     
    Input Output
    LAN：
    1 RJ45 1 GbE Dedicated BMC LAN port(s)

    USB：
    2 USB 3.0 port(s) (rear)

    Video：
    1 VGA port(s)

    DOM：
    2 SuperDOM (Disk on Module) port(s)
     
    Cooling
    Fans：
    4x 8cm heavy duty fans with optimal fan speed control
    Air Shroud：
    2 Air Shroud(s)
     
    Operating Environment
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (non-condensing)
    Non-operating Relative Humidity: 5% to 95% (non-condensing)
     
    Details
    Security
    Hardware：
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features：
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    System Lockdown

    PC Health Monitoring
    CPU：
    Monitors for CPU Cores, Chipset Voltages, Memory
    7 +1 Phase-switching voltage regulator
    FAN：
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature：
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • SYS-221BT-DNC8R
    SYS-221BT-DNC8R
    $11,039.00
    CONFIGURE
    SKU
    SYS-221BT-DNC8R 
    Processor
    (per Node)
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
    Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)​

    Core Count:
    Up to 64C/128T; Up to 320MB Cache per CPU

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Supports up to 350W TDP CPUs (Liquid Cooled)​
     
    Memory
    (per Node)
    Memory:
    Slot Count: 16 DIMM slots
    Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.47" (88mm)
    Width:
    17.68" (449mm)
    Depth:
    28.75" (730mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button
    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
    (per Node)
    SAS:
    SAS3 (12Gbps) via Broadcom® 3816 (IT mode)

    Chipset:
    Intel® C741

    Network Connectivity:
    Via AIOM

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Hot-swap:
    12x 2.5" hot-swap NVMe/SAS drive bays (2x PCI-E 5.0 NVMe/SAS and 10x PCI-E 4.0 NVMe/SAS)

    M.2:
    2 M.2 NVMe
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x8 LP slot(s)
    1 PCIe 5.0 x16 LP slot(s)
     
    Power Supply
    2200W Redundant Power Supplies with PMBus
    Total Output Power:
    2200W : 100 - 240 Vac
    2090W : 230 - 240 Vdc for CCC only

    Dimension (W x H x L):
    45 x 40 x 480 mm

    AC Input:
    1200W: 100-127Vac / 50-60Hz
    2090W: 180-220Vac (for UL/cUL only)
    1800W: 200-220Vac / 50-60Hz
    1980W: 220-230Vac / 50-60Hz
    2200W: 220-240Vac (for UL/cUL only)
    2090W: 230-240Vac / 50-60Hz
    2090W: 230-240Vdc (for CCC only)

    +12V:
    Max: 100A / Min: 0A (100-127Vac)
    Max: 150A / Min: 0A (200-220Vac)
    Max: 165A / Min: 0A (220-230Vac)
    Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
    Max: 174.17A / Min: 0A (230-240Vac)
    Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
    Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
    12V SB:
    Max: 2.1A / Min: 0A

    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port

    USB:
    2 USB 3.1 port(s) (2 rear)

    Video:
    1 VGA port(s)

    Others:
    2x M.2 for boot drive or caching  
    M.2 form factor: NVMe double-sided 22x110mm
    Note: Enterprise-grade M.2 only for caching application
     
    Cooling
    Fans:
    4x 16.5K RPM Heavy Duty 8cm Fan(s)
    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    RoHS:
    RoHS Compliant
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (Non-Condensing)
    Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)
     
    Details
    Management
    Software:
    Supermicro Out of Band (OOB) License (Included per Node)
    SuperCloud Composer
    SSM
    Intel® Node Manager
    SPM
    KVM with dedicated LAN
    IPMI 2.0
    SUM
    Watch Dog
    SuperDoctor® 5
    Power Configurations:
    ACPI / APM Power Management
     
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