3U - Intel Xeon Scalable Servers

CPU:
Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake), 3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
Cores:
Up to 28 Cores
Note:
BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors

Memory Capacity:
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note:
2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Cascade Lake only. Contact your Supermicro sales rep for more info.

3U Rackmount Chassis

Width:
17.2" (437mm)
Height:
5.2" (132mm)
Depth:
25.5" (648mm)

Buttons:
Power On/Off button
System Reset button
LEDs:
Power status LED
Hard drive activity LED
Network activity LEDs
System Overheat LED
Power fail LED

BIOS Type:
256Mb AMI UEFI

Chipset:
Intel® C624 chipset
SAS:
SAS3 (12Gbps) via Broadcom 3008 AOC
Broadcom 3008 controller
SATA:
SATA3 (6Gbps) with RAID 0, 1, 5, 10
Network Controllers:
Dual 10GBase-T LAN ports with Intel X722 + PHY Intel X557
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics:
ASPEED AST2500 BMC

Drive Bays
Hot-swap:
16 Hot-swap 3.5" SAS3/SATA3 drive bays
Optional:
2 Optional Onboard NVMe M.2
 
Backplane:
SAS3 12Gbps single expander backplane, w/ 16x SAS3 3.5" drive slots and 2x mini-SAS HD connectors for JBOD expansion

3x PCI-E 3.0 x16 slot
4x PCI-E 3.0 x8 slots
Slot 2 & 3 occupied by controller and JBOD Expansion Port

(76mm Width)
1200W Redundant Power Supplies with PMBus
Total Output Power:
1000W/1200W
Dimension (W x H x L):
76 x 40 x 336 mm
Input:
100-127Vac / 15-12A / 50-60Hz
200-240Vac / 8.5-7A / 50-60Hz
+12V:
Max: 83A / Min: 0A (100-127Vac)
Max: 100A / Min: 0A (200-240Vac)
+5Vsb:
Max: 4A / Min: 0A
Output Type:
19 Pairs Gold Finger Connector
Certification:
UL/cUL/CB/BSMI/CE/CCC
Titanium Level

LAN:
2x RJ45 10GBase-T LAN ports
1x RJ45 Dedicated IPMI LAN port
USB:
4x USB 3.0 ports (rear)
1x Type A
VGA:
1x VGA port
Serial Port / Header:
1x Fast UART 16550 port / 1x Header

3x Hot-swap 8cm redundant PWM cooling fans
2x Hot-swap 8cm rear exhaust PWM fans
Redundant cooling

RoHS:
RoHS Compliant
Environmental Spec.:
Operating Temperature: 
   10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 
   -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 
   8% to 90% (non-condensing)
Non-operating Relative Humidity: 
   5% to 95% (non-condensing)

 

CPU:
Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake), 3 UPI up to 10.4GT/s
Support CPU TDP 205W
Cores:
Up to 28 Cores
Note:
BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors

Memory Capacity:
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note:
2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Cascade Lake only. Contact our sales rep for more info.

3U Server Chassis

Width:
17.2" (437mm)
Height:
5.2" (132mm)
Depth:
25.5" (648mm)

Buttons:
Power On/Off button
System Reset button
LEDs:
Power status LED
Hard drive activity LED
Network activity LEDs
System information (overheat/UID) LED
Power fail LED

BIOS Type:
AMI UEFI

 

Chipset:
Intel® C621 chipset
SATA:
SATA3 (6Gbps) with RAID 0, 1, 5, 10
Network Controllers:
Intel® X550-AT2 Dual Port 10GBase-T
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics:
ASPEED AST2500 BMC

Hot-swap:
8x Hot-swap 3.5" drive bays
Others:
2x 5.25" drive bays
Backplane:
1x SAS/SATA backplane

1x slim DVD-ROM drive

2x PCI-E 3.0 x16 slots (HSSI)
2x PCI-E 3.0 x16 slots (or 4 PCI-E 3.0 x8 by Mixed)
4x PCI-E 3.0 x8 slots
1x PCI-E 3.0 x4 (in x8 slot)

850W/980W high-efficiency (94%+) AC-DC Redundant power supplies with PMBus
AC Input:
100-140 V, 50-60 Hz, 11.5-6.5 Amp
180-240 V, 50-60 Hz, 6.5-4.5 Amp
DC Output:
  4 Amp @ +5V Standby
  70 Amp @ +12V (100-140Vac)
  81 Amp @ +12V (180-240Vac)
With Power Distributor:
+5V: 30 Amp
+3.3V: 28 Amp
-12V: 0.6 Amp
Certification:
  Platinum Level

3x Middle fans
1x Rear exhaust fan

RoHS:
RoHS Compliant
Environmental Spec.:
Operating Temperature: 
   10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 
   -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 
   8% to 90% (non-condensing)
Non-operating Relative Humidity: 
   5% to 95% (non-condensing)

CPU:
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Cores / Cache:
Up to 28 cores
Note:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Memory Capacity:
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes:
RDIMM: 64GB
LRDIMM: 128GB
3DS LRDIMM: 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Rackmount Chassis

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

BIOS Type:
AMI UEFI

Chipset:
Intel® C621
SATA:
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2500
Network Controllers:
Dual LAN with 1GbE LAN with Intel® X722
Graphics:
ASPEED AST2500 BMC

6x 2.5" Hot-swap HDD bays

8 x Full Height ( 3 x Double-width GPGPU )

1600W Redundant PSU

SATA:
14x SATA3 (6Gbps) port
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
4x USB 2.0 ports (2x rear + 2x via headers)
5x USB 3.2 Gen1 ports (2x rear + 2x via headers + 1x Type A)
Video Output:
1x VGA port
Serial Port / Header:
2x COM Ports (1x rear, 1x header)
TPM:
1x TPM Header

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

CPU:
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Cores / Cache:
Up to 28 cores
Note:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Memory Capacity:
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes:
RDIMM: 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors

3U Rackmount Chassis

D x W x H
450.0 x 438.0 x 131.0 mm
17.72” x 17.24” x 5.15”

 

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

Chipset:
Intel® C621
SATA:
Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2500
Network Controllers:
Dual LAN with 1GbE with Intel® I210
Graphics:
ASPEED AST2500 BMC

6x 2.5" Hot-swap HDD bays

8 x Full Height ( 3 x Double-width GPGPU )

1600W Redundant PSU

SATA:
8x SATA3 (6Gbps) port
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
8x USB 2.0 ports (2x rear + 6x via headers)
5x USB 3.2 Gen1 ports (2x rear + 2x via headers + 1x Type A)
Video Output:
1x VGA port
Serial Port / Header:
2x COM Ports (1x rear, 1x header)
TPM:
TPM Header

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

CPU:
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core:
Up to 40 cores

Memory Capacity:
18 DIMM slots
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz
Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz
P1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
Memory Type:
3200/2933/2666MHz ECC 3DS DDR4 LRDIMM, RDIMM
DIMM Sizes:
LRDIMM: 256GB
RDIMM: 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

2U Rackmount Chassis

17.72” x 17.24” x 5.15”

1x Power On/Off
1x System Reset
1x UID
1x USB 3.0

BIOS Type:
AMI UEFI

Chipset:
Intel® C621A
SATA:
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2600 BMC
Network Controllers:
Dual LAN with Intel® i350 Gigabit Ethernet Controller

6x 2.5" Hot-swap HDD bays

8x Full Height ( 3 x Double-width GPGPU )

1600W Redundant PSU

SATA:
14x SATA3 (6Gbps) port(s)
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
7x USB 3.2 Gen1 port(s) (2x via header; 4x rear; 1x type A)
2x USB 2.0 port(s) (2x via header)
Video Output:
2x VGA (1x rear bezel, 1x front panel) port(s)
Serial Port:
2x COM Port(s) (1x header; 1x rear)
TPM:
1x TPM Header

Rear : 80 mm(4) , 11000 RPM
up to T=38 mm, Hot-swap

CPU:
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
Core:
Up to 28 cores
Note:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Memory Capacity:
16 DIMM slots
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, DDR4-2666MHz
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
LRDIMM: 128GB
RDIMM: 64GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Chassis

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel:
System power on/off
System reset
2x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

Chipset:
Intel® C621
SATA:
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2500
Graphics:
ASPEED AST2500 BMC
Network Controllers:
Dual LAN with 1GbE LAN with Intel® X722

Drive Bays
External: 
16x 3.5" hot swap
2x 2.5" hot swap rear
Internal:
2x 2.5 Internal
Backplane
1x 16-port 12Gb SATA/SAS backplane with 28-PHY expander chip and 3 SFF-8643 connectors

7 slots

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

3x 80x38mm PWM & low-power consumption hot swap fans

CPU:
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Core:
Up to 28 cores
Note:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Memory Capacity:
8 DIMM slots
Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Memory Type:
2933/2666/2400/2133MHz ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
LRDIMM: 32GB, 64GB, 128GB
RDIMM: 8GB, 16GB, 32GB, 64GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors

3U Chassis

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel:
System power on/off
System reset
2 x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

BIOS Type:
AMI UEFI
BIOS Features:
ACPI 6.0
RTC (Real Time Clock) Wakeup
SMBIOS 3.0 or later

Chipset:
Intel® C621
SATA:
Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2500
Graphics:
ASPEED AST2500 BMC
Network Controllers:
Dual LAN with 1GbE with Intel® I210

7x Slots

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

onboard Input / Output
SATA:
8x SATA3 (6Gbps) port(s)
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
3x USB 3 port(s) (1 Type A; 2 via header)
8x USB 2.0 port(s) (2 rear; 6 via header)
2x USB 3.0 port(s) (2 rear)
Video Output:
1x VGA port(s)
Serial Port:
2x COM Port(s) (1 header; 1 rear)
DOM:
2x SATA DOM (Disk on Module) power connector support
TPM:
1x TPM Header

3x 80x38mm PWM & low-power consumption hot swap fans

CPU:
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core:
Up to 40 cores

Memory Capacity:
18 DIMM slots
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz
Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz
P1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
Memory Type:
3200/2933/2666MHz ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
LRDIMM: 256GB
RDIMM: 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors
Detects double-bit errors (using ECC memory)

3U Chassis

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel:
System power on/off
System reset
2x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

BIOS Type:
AMI UEFI

Chipset:
Intel® C621A
SATA:
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2600 BMC
Network Controllers:
Dual LAN with Intel® i350 Gigabit Ethernet Controller

Drive Bays
External:
16x 3.5" hot swap
2x 2.5" rear hot swap
Internal
4x 2.5” internal
Backplane
1x 16-port 12Gb SATA/SAS backplane with 28-PHY expander chip and 3 SFF-8643 connectors

7x low profile

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

Onboard Input / Output
SATA:
14x SATA3 (6Gbps) port(s)
LAN:
2x RJ45 Gigabit Ethernet LAN ports
USB:
7x USB 3.2 Gen1 port(s) (2 via header; 4 rear; 1 type A)
2x USB 2.0 port(s) (2 via header)
Video Output:
2x VGA (1 rear bezel, 1 front panel) port(s)
Serial Port:
2x COM Port(s) (1 header; 1 rear)
TPM:
1x TPM Header

3x 80x38mm PWM & low-power consumption hot swap fans

CPU:
3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Core:
Up to 40 cores

Memory Capacity:
8 DIMM slots
Up to 2TB Intel® Optane™ Persistent Memory 200 Series
Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz
Memory Type:
3200/2933/2666MHz ECC , DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes:
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage:
1.2V
Error Detection:
Corrects single-bit errors

3U Chassis

430mm x 680mm x 133mm
17" x 26.8" x 5.2"

Front Panel:
System power on/off
System reset
2 x USB 3.0 port
LED Indicators:
Power
LAN
Drive
Alert

BIOS Type:
AMI UEFI
BIOS Features:
ACPI 6.2
SMBIOS 3.0 or later
UEFI 2.7

Chipset:
Intel® C621A
SATA:
Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI:
ASPEED AST2600 BMC
Graphics:
ASPEED AST2600 BMC
Network Controllers:
Dual LAN with Intel® i210 Gigabit Ethernet Controller

Drive Bays
External: 
16x 3.5” hot swap
2x 2.5” hot swap
Internal:
4x 2.5” internal
Backplane
1x 16-port 12Gb SATA/SAS backplane with 28-PHY expander chip and 3 SFF-8643 connectors

7 low profile

800W 1+1 redundant PSU PMBus 1.2 80+ Platinum

Onboard Input / Output
SATA
10x SATA3 (6Gbps) port(s)
LAN
2x RJ45 Gigabit Ethernet LAN ports
USB
6x USB 2.0 port(s) (4 via header; 2 rear)
5x USB 3.2 Gen1 port(s) (2 via header; 2 rear; 1 type A)
Video Output
1x VGA port(s)
Serial Port
1x COM Port(s) (1 header)
DOM
2x SATA DOM (Disk on Module) power connector support
TPM
1x TPM Header

3x 80x38mm PWM & low-power consumption hot swap fans