Liquid Cooling Solutions

LIQUID COOLING SOLUTIONS

Liquid Cooling Solutions From Rackmountpro
Reduce Costs, Save Energy and Improve Performance

As the performance of CPUs and GPUs continues to increase, the heat that these processors generate continues to grow. While the work (operations per second) performed per watt also increases, the density of these new generations of servers that contain multiple CPUs and the latest generation of GPUs is also growing. Air cooling, which brings cooler air over the hot CPUs, relies on the temperature of the inlet air and the amount of air passed over the hot chips. To keep the CPUs within designed thermal envelopes, the inlet temperature and the capacity of the fans to move air (CFM) are critical elements of maintaining a server running at desired clock rates. Air cooling requires high energy usage computer room air conditioning and server fans running constantly. To reduce OPEX, liquid cooling is a viable alternative to CRAC and will become more prevalent in the future as CPUs will generate more heat with each new generation.


REDUCTION	REDUCTION	REDUCTION
Electricity Costs of Cooling Infrastructure in Server	in Electricity Costs for Entire Data Center	in Datacenter Server Noise

RACK SAMPLE CONFIGURATIONS

SRS-48UDTN-SKU1-L1-SMCI

Up to 4 GPU Servers (8U, 8 NVIDIA H100 HGX
GPUs) per 42U Rack (32 NVIDIA H100 HGX
GPUs total)

SRS-48UBTW-SKU1-L1-SMCI

Up to 76 Servers Nodes / 19 Systems
in a 48U Rack

SRS-48UBLD-SKU1-L1-SMCI

Up to 80 Server Blades / 4 Systems
in a 48U Rack

Product	Qty
Supermicro GPU Server SYS-821GE-TNHR	4
CDU	1
Vertical CDM	1
Horizontal CDM	4
SWITCH	1

Product	Qty
BigTwin (2U4N) or 2U Hyper or 1U Hyper (shown)	19 21 44
CDU	1
Vertical CDM	1
SWITCH	1

Product	Qty
SuperBlade Enclosure (8U20N)	4
SBI-421E-1T3N	80
CDU	1
Vertical CDM	1
Horizontal CDM	8
SWITCH	1

RACK SCALE ADVANCED ENGINEERING
As the Rack becomes the unit for scalable computing, engineering a liquid cooled rack requires careful planning and expert assembly. A liquid cooling system needs to be flexible to handle a wide range of servers, while being able to cool an entire rack of high performance systems

	RACK SCALE SOLUTION Rack Level • Design • Assembly • Configuration • Testing • Logistics
COMPONENTS OF AN EFFICIENT LIQUID COOLING SOLUTION Supermicro’s liquid cooled rack solution is made of several components that are designedin house to achieve the highest level of performance and reliability. All the components are integrated as a rack level solution providing a true one-stop shop customer experience.

Coolant Distribution Unit (CDU)-

contains the pumping system that circulates the coolant to the cold plates cooling down the CPUs and GPUs. The Supermicro CDU integrates 2 hotswappable and redundant pumping modules and power supply modules guaranteeing nearly a 100% uptime to the operator. The CDU cooling capacity is up to 100kW enabling extremely high rack densities. The CDU also offers an easy-to-use touch screen to monitor and control the rack operation with WebUI access and integrated in Supermicro’s Super Cloud Composer datacenter management software. The CDU control system optimizes power consumption while ensuring efficient cooling is delivered to all the CPUs and GPUs. An effective anti-condensation strategy is adopted to prevent any hardware degradation.

Coolant Distribution Manifold (CDM)

The CDM are the distribution pipes that supply coolant to each server and collect the hotter coolant back to the CDU. There are two types of CDMs:

Vertical

Vertical manifolds are placed at the back of the rack and directly connected to the CDU with hoses. They deliver coolant to the cold plates on systems with inlet and outlet hoses at the back of the rack.

Horizontal

Horizontal manifolds are placed at the front of the rack in a 1U rack mount space. They connect the vertical manifolds at the rear of the rack to cold plates on systems with inlet and outlet hoses at the front of the rack (SuperBlades and 8U GPU servers)

Hoses and Connectors Flexible hoses are used to bring the cooler liquid to the CPUs and GPUs cold plates and return the hot liquid to the CDMs. The Supermicro connectors are single handed, 0 drip, quick disconnector, they allow operators to service liquid cooled systems safely and efficiently.

Cold Plates The cold plates are placed on top of the CPUs and GPUs; flowing coolants through their micro sized channels cools down the chips very efficiently. The Supermicro cold plates are designed to reduce hot spots on the chip and reach ultra-low thermal resistance.

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Results For: Liquid Cooling Solutions

AS-1125HS-TNR

$6,657.00

CONFIGURE

SKU	AS-1125HS-TNR

Processor

CPU:

Dual Socket SP5

4th Generation AMD EPYC™ 9004 Series Processor

Support CPU TDP up to 360W

Cores:

Up to 192C/384T

Note:

Certain CPUs with high TDP may be supported only under specific conditions. Please contact our Technical Support for additional information about specialized system optimization

Memory

Memory:
Memory Capacity: 24 DIMM slots
Up to 6TB: 3DS ECC Registered RDIMM, DDR5-4800MHz
Memory Type: 4800MHz ECC DDR5 RDIMM Up to 512GB of memory
Note:
For optimal performance AMD recommends full memory population
Memory Voltage:
1.1 V
Error Detection:
Corrects single-bit errors Detects double-bit errors (using ECC memory)

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
29.4" (747mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
Power status
System information

Bios	BIOS Type: AMI 256MB SPI Flash BIOS Features: ACPI 6.4 Plug and Play (PnP) SMBIOS 3.5 or later UEFI 2.8 USB Keyboard support

Onboard Devices

Chipset:
System on Chip
Network Connectivity:
Via AIOM
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Up to 12x 2.5" hot-swap NVMe/SATA/SAS support with additional parts)
M.2:
2x NVMe (PCIe 3.0 x4, Boot drive only)
M-Key, 2280/22110

Expansion Slots

1 PCIe 5.0 x16 FH, 6.6"L slot(s)
2 PCIe 5.0 x16 FH, 10.5"L slot(s)

Power Supply

1U 800W/1200W Redundant Titanium CRPS w/PMBus power supply
Dimension(W x H x L):
73.5 x 40 x 265 mm
AC Input:
800W: 100-127Vac / 9.8A-7A / 50-60Hz
1200W: 200-240Vac / 7.5A-6A / 50-60Hz
+12V:
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
25 Pairs Gold Finger Connector
Certification:
Titanium Level

Input Output

LAN:
1 Dedicated IPMI LAN port
USB:
3 USB 3.0 port(s) (1 front; 2 rear)
Video:
1 VGA port(s)

Cooling

Fans:
8x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2x Air Shroud(s)

Operating Environment

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)
Note:
Operating Temperature based on configurations

AS-2125HS-TNR

$7,777.00

CONFIGURE

SKU	AS-2125HS-TNR

Processor

CPU:
Dual Socket SP5
4th Generation AMD EPYC™ 9004 Series Processor
Support CPU TDP up to 360W
Cores:
Up to 192C/384T
Note:
Certain CPUs with high TDP may be supported only under specific conditions. Please contact our Technical Support for additional information about specialized system optimization

Memory

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.5" (88.9mm)
Width:
17.2" (437mm)
Depth:
29.9" (760mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
Power status
System information

Bios	BIOS Type: AMI 256MB SPI Flash BIOS Features: ACPI 6.4 Plug and Play (PnP) SMBIOS 3.5 or later UEFI 2.8 USB Keyboard support

Onboard Devices

Chipset:
System on Chip
Network Connectivity:
Via AIOM
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
24x 2.5" hot-swap NVMe/SATA/SAS drive bays
M.2:
2x NVMe (PCIe 3.0 x4, Boot drive only)
M-Key, 2280/22110

Expansion Slots

4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)

Power Supply

1600W 1U redundant power supply
Dimension (W x H x L):
73.5 x 40 x 265 mm
AC Input:
1000W: 100-127Vac / 12A-9A / 50-60Hz
1600W: 200-240Vac / 9A-7.5A / 50-60Hz
+12V:
Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 3.5A / Min: 0A
Output Type:
25 Pairs Gold Finger Connector
Certification:
Titanium Level

Input Output

LAN:
1 Dedicated IPMI LAN port
USB:
2 USB 3.0 port(s) (2 rear)
Video:
1 VGA port(s)

Cooling

Fans:
4x 8cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)

Operating Environment

AS-4125GS-TNRT

$9,293.00

CONFIGURE

SKU	AS-4125GS-TNRT

Processor

CPU:
Dual Socket SP5
AMD EPYC™ 9004 Series Processors
Support CPU TDP up to 360W
Cores:
Up to 96C/192T

Memory

Memory:
Memory Capacity: 24 DIMM slots
Up to 6TB: 24x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5 RDIMM/LRDIMM
Note:
Full memory population recommended for optimal performance.
Memory Voltage:
1.2 V
Error Detection:
ECC

Chassis

4U Rackmount Chassis

Dimensions

Height:
7" (178mm)
Width:
17.2" (437mm)
Depth:
29" (737mm)

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

SATA:
SATA3 (6Gbps)
Chipset:
AMD SP5
Network Connectivity:
2x 10GbE BaseT
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
24x 2.5" hot-swap NVMe/SATA/SAS drive bays (4x 2.5" NVMe dedicated)
M.2:
1 M.2 NVMe OR 1 M.2 SATA3

Expansion Slots

PCI-Express (PCIe):
9 PCIe 5.0 x16 FHFL slot(s)

Power Supply

2000W 1U redundant power supply W73.5 x L203 x H40mm
Dimension (W x H x L):
73.5 x 40 x 203 mm
AC Input:
1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz
2000W: 230-240Vac / 50-60Hz
2000W: 230-240Vdc
+12V:
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)
12V SB:
Max: 3.5A / Min: 0A
Output Type:
Backplanes (gold finger)
Certification:
Titanium Level

Input Output

Video:
1 VGA port(s)

Cooling

8 heavy duty fans with optimal fan speed control

Operating Environment

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

AS-8125GS-TNHR

Please Inquire

CONFIGURE

SKU	AS-8125GS-TNHR

Processor

CPU:
Dual Socket SP5
AMD EPYC™ 9004 Series Processors

Core Count:
Up to 128C/256T

Note:
Supports up to 400W TDP CPUs (Air Cooled)

Max GPU Count:
Up to 8 onboard GPU(s)

Supported GPU:
NVIDIA SXM: HGX H100 8-GPU (80GB)

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink® with NVSwitch™

Memory

Memory:
Slot Count: 24 DIMM slots
Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

8U Rackmount Chassis

Dimensions

Height:
14" (355.6 mm)
Width:
17.2" (437 mm)
Depth:
33.2" (843.28 mm)

Front Panel

LED:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Buttons:
Power On/Off button
System Reset button

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:

AMD SP5

NVMe

Network Connectivity

HDD Drive Bays

Drive Bays Configuration:
Default: Total 18 bay(s)
2 front hot-swap 2.5" SATA drive bay(s)
4 front hot-swap 2.5" NVMe drive bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
(NVMe support may require additional storage controller and/or cables)

M.2:
1 M.2 NVMe slot(s) (M-key)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
8 PCIe 5.0 x16 LP slot(s)
2 PCIe 5.0 x16 FHFL slot(s)

Power Supply

1x 3000W Redundant Titanium Level power supply
Dimension (WxHxL):
106.5 x 82.1 x 245.5 mm

+12V:
Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3A / Min: 0A

AC Input:
3000W: 207-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

Input Output

Video:
1 VGA port(s)

Cooling

Fans:
10 heavy duty fans with optimal fan speed control

Operating Environment

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

SBE-820C

Please Inquire

CONFIGURE

SKU

SBE-820C

Details

Processor Blade:
Up to 20 half-height 2-socket blade servers
Up to 10 full-height 4-socket blade servers

LED:
Power LED, Fault LED

Networking:
Infiniband EDR or OPA Switch – Support for 1x 100Gbps switch
Ethernet Switch – Up to 2x modules
For compatibility, see the Blade Matrix or contact your Supermicro representative
Switch Modules must be purchased separately

Management Module:
1 CMM for remote system management with software
Management Module must be purchased separately

Power Supplies:
Up to 8 hot-plug 2200W Titanium power supplies

Cooling Design:
Up to 8 cooling fans in PWS modules
3 optional cooling fan modules (PWS-DF005-2F)

Dimensions (HxWxD):
14" x 17.6" x 32"

Available Models:
SBE-820C-822 - Enclosure with 8 hot-plug 2200W Titanium (96% efficiency) power supplies

SBE-820C-622 - Enclosure with 6 hot-plug 2200W Titanium (96% efficiency) power supplies + 2 cooling fans

SBE-820C-422 - Enclosure with 4 hot-plug 2200W Titanium (96% efficiency) power supplies + 4 cooling fans

SBE-820H

Please Inquire

CONFIGURE

SKU

SBE-820H

Details

Processor Blade:
Up to 20 half-height 2-socket blade servers

LED:
Power LED, Fault LED

Networking:
Infiniband HDR Switch – Support for 1x 200Gbps module
Ethernet Switch – Up to 2x modules
For compatibility, see the Blade Matrix or contact your Supermicro representative
Switch Modules must be purchased separately

Management Module:
1 CMM for remote system management with software
Management Module must be purchased separately

Power Supplies:
Up to 8 hot-plug 2200W Titanium power supplies

Cooling Design:
Up to 8 cooling fans in PWS modules
3 optional cooling fan modules (PWS-DF005-2F)

Dimensions (HxWxD):
14" x 17.6" x 32"

Available Models:
SBE-820H-822 - Enclosure with 8 hot-plug 2200W Titanium (96% efficiency) power supplies

SBE-820H-622 - Enclosure with 6 hot-plug 2200W Titanium (96% efficiency) power supplies

SBE-820J

Please Inquire

CONFIGURE

SKU

SBE-820J

Details

Processor Blade:
Up to 20 half-height 2-socket blade servers
Up to 10 full-height 4-socket blade servers
Mixed blade servers in a single enclosure

LED:
Power LED, Fault LED

Networking:
Ethernet Switch – Up to 4x modules
For compatibility, see the Blade Matrix or contact your Supermicro representative
Switch Modules must be purchased separately

Management Module:
Up to 2 CMMs for remote system management with software
Management Module(s) must be purchased separately

Power Supplies:
Up to 8 hot-plug 2200W Titanium power supplies

Cooling Design:
Up to 8 cooling fans in PWS modules
3 optional cooling fan modules (PWS-DF005-2F)

Dimensions (HxWxD):
14" x 17.6" x 32"

Available Models:
SBE-820J-822 - 25G Enclosure with 8 hot-plug 2200W Titanium (96% efficiency) power supplies

SBE-820J-622 - 25G Enclosure with 6 hot-plug 2200W Titanium (96% efficiency) power supplies + 2 cooling fans

SBE-820J-422 - 25G Enclosure with 4 hot-plug 2200W Titanium (96% efficiency) power supplies + 4 cooling fans

SBE-820J2

Please Inquire

CONFIGURE

SKU

SBE-820J2

Details

Processor Blade:
Up to 20 half-height 2-socket blade servers
Up to 10 full-height 4-socket blade servers
Mixed blade servers in a single enclosure

LED:
Power LED, Fault LED

Networking:
Ethernet Switch – Up to 4x modules
For compatibility, see the Blade Matrix or contact your Supermicro representative
Switch Modules must be purchased separately

Management Module:
Up to 2 CMMs for remote system management with software
Management Module(s) must be purchased separately

Power Supplies:
Up to 8 hot-plug 2200/3000W Titanium power supplies

Cooling Design:
Up to 8 cooling fans in PWS modules
3 optional cooling fan modules (PWS-DF005-2F)

Dimensions (HxWxD):
14" x 17.6" x 32"

Available Models:
SBE-820J2-630 - Up to 6 hot-swappable 3000W Titanium (96% efficiency) power supplies
SBE-820J2-830 - Up to 8 hot-swappable 3000W Titanium (96% efficiency) power supplies
SBE-820J2-422 - Up to 4 hot-swappable 2200W Titanium (96% efficiency) power supplies
SBE-820J2-622 - Up to 6 hot-swappable 2200W Titanium (96% efficiency) power supplies
SBE-820J2-822 - Up to 8 hot-swappable 2200W Titanium (96% efficiency) power supplies

SBE-820L

Please Inquire

CONFIGURE

SKU

SBE-820L

Details

Processor Blade:
Up to 20 half-height 2-socket blade servers
Up to 10 full-height 4-socket blade servers
Mixed blade servers in a single enclosure

LED:
Power LED, Fault LED

Networking:
Ethernet Switch – Up to 2x modules
For compatibility, see the Blade Matrix or contact your Supermicro representative
Switch Modules must be purchased separately

Management Module:
1 CMM for remote system management with software
Management Module must be purchased separately

Power Supplies:
Up to 8 hot-plug 2200W Titanium power supplies

Cooling Design:
Up to 8 cooling fans in PWS modules
3 optional cooling fan modules (PWS-DF005-2F)

Dimensions (HxWxD):
14" x 17.6" x 32"

Available Models:
SBE-820L-822 - Enclosure with 8 hot-plug 2200W Titanium (96% efficiency) power supplies

SBE-820L-622 - Enclosure with 6 hot-plug 2200W Titanium (96% efficiency) power supplies

SBE-820L-422 - Enclosure with 4 hot-plug 2200W Titanium (96% efficiency) power supplies

SBI-421E-1T3N

Please Inquire

CONFIGURE

SKU	SBI-421E-1T3N

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Intel® Xeon® CPU Max Series with High Bandwidth Memory (HBM)

Note:
Up to 205W TDP CPUs (Air Cooling at 35°C)
Certain CPUs with higher TDP may be supported under specific conditions. Please refer to Thermal Matrix.
Up to 350W TDP CPUs (Direct Liquid Cooling)

Memory

16 DDR5 DIMM slots
1DPC with 5600MHz ECC RDIMM

Chassis

Single Blade Server

Dimensions

Height:
1.75"
Width:
6.5"
Depth:
23.5"

Front Panel

Buttons:
Power On/Off button

LEDs:
Power LED
UID
Network Activity LED
Fault LED

Connector:
SUV (Serial/USB/Video) Connector

Bios	BIOS Type: 256Mb SPI Flash EEPROM with AMI® BIOS BIOS Features: Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support

Onboard Devices

Chipset:
Intel® C741 chipset

Network Controllers:
Onboard Dual 25G Ethernet
1 Mezzanine expansion slot and 3 different optional Mezzanine card.
1 OCP 3.0 network card (option)
Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR

MGMT/Security:
IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust

Graphics:
Aspeed AST2600

HDD Drive Bays

Hot-swap:
2 Hot-swap U.2 NVMe/SATA3 drive bays
1 Hot-swap SATA3 drive bay

M.2:
1 M.2 2280
Optional: 4 M.2 NVMe via mezz card

Input Output

TPM:
1 TPM 2.0 Header

Operating Environment

RoHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

SRS-48UGPU-SKU1-L1-SMCI
Please Inquire
CONFIGURE

SKU
SRS-48UGPU-SKU1-L1-SMCI

SYS-121H-TNR

$15,260.00

CONFIGURE

SKU	SYS-121H-TNR

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
Air Cooled CPUs with TDP over 250W only supported under specific conditions.

Memory

Memory：
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Memory Voltage：
1.1 V

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
29.4" (747mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
Power
System information

Bios	BIOS Type: AMI 256MB SPI Flash

Onboard Devices

SATA:
SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe:
NVMe; RAID 0/1/5/10 support (Intel® VROC RAID key required)
Chipset:
Intel® C741
Network Connectivity:
2x 1GbE BaseT with Intel® i350-AM2 (optional)
4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
2x 10GbE BaseT with Intel® X550-AT2 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:

8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Configurable option for 12x 2.5" hot-swap NVMe/SAS/SATA drive bays. NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)

M.2:

2 M.2 NVMe OR 2 M.2 SATA3

M-Key, 2280/2210

Expansion Slots

1 PCIe 5.0 x16 FH, 6.6"L slot(s)
2 PCIe 5.0 x16 FH, 10.5"L slot(s)

Power Supply

1U 800W/1200W Redundant Titanium CRPS w/PMBus power supply, W73.5xH40xL265mm
Dimension (W x H x L):
73.5 x 40 x 265 mm
AC Input:
800W: 100-127Vac / 9.8A-7A / 50-60Hz
1200W: 200-240Vac / 7.5A-6A / 50-60Hz
+12V:
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
25 Pairs Gold Finger Connector
Certification:
Titanium Level

Input Output

LAN:
1 RJ45 Dedicated BMC LAN port
USB:
1 USB 3.0 port(s) (1 front)
2 USB 2.0 port(s) (2 rear)
Video:
1 VGA port(s)

Cooling

Fans:
8x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

Details

Management
Software:
Redfish API
IPMI 2.0
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Watch Dog
SuperDoctor® 5
Power Configurations:
Power-on mode for AC power recovery
ACPI Power Management

SYS-221BT-DNTR

$10,145.00

CONFIGURE

SKU	SYS-221BT-DNTR

Processor

(per Node)

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)

Memory

(per Node)
Memory:
Slot Count: 16 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.47" (88mm)
Width:
17.68" (449mm)
Depth:
28.75" (730mm)

Front Panel

Buttons:
Power On/Off button
UID button

LEDs:
HDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED

Bios	BIOS Type: AMI 32MB Flash ROM

Onboard Devices

(per Node)
Chipset:
Intel® C741

Network Connectivity:
Via AIOM

IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

(per Node)
Hot-swap:
12x 2.5" hot-swap NVMe/SATA drive bays (2x PCI-E 5.0 NVMe/SATA and 10x PCI-E 4.0 NVMe/SATA)
M.2:
2 M.2 NVMe

Expansion Slots

(per Node)
PCI-Express (PCIe):
2 PCIe 5.0 x8 LP slot(s)
1 PCIe 5.0 x16 LP slot(s)

Power Supply

2200W Redundant Power Supplies with PMBus
Total Output Power:
2200W : 100 - 240 Vac
2090W : 230 - 240 Vdc for CCC only

Dimension (W x H x L):
45 x 40 x 480 mm

AC Input:
1200W: 100-127Vac / 50-60Hz
2090W: 180-220Vac (for UL/cUL only)
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2200W: 220-240Vac (for UL/cUL only)
2090W: 230-240Vac / 50-60Hz
2090W: 230-240Vdc (for CCC only)

+12V:
Max: 100A / Min: 0A (100-127Vac)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)

12V SB:
Max: 2.1A / Min: 0A

Certification:
Titanium Level

Input Output

(per Node)
LAN:
1 RJ45 Dedicated BMC LAN port

USB:
2 USB 3.1 port(s) (2 rear)

Video:
1 VGA port(s)

Others:
2x M.2 for boot drive or caching
M.2 form factor: NVMe double-sided 22x110mm
Note: Enterprise-grade M.2 only for caching application

Cooling

Fans:
4x 16.5K RPM Heavy Duty 8cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

RoHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (Non-Condensing)
Non-operating Relative Humidity:
5% to 95% (Non-Condensing)

Details

Management
Software:
Supermicro Out of Band (OOB) License (Included per Node)
SuperCloud Composer
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
IPMI 2.0
SUM
Watch Dog
SuperDoctor® 5

Power Configurations:
ACPI / APM Power Management

SYS-221BT-HNTR

$13,033.00

CONFIGURE

SKU	SYS-221BT-HNTR

Processor

(per Node)

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 205W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
Air Cooled CPUs with TDP over 205W only supported under specific conditions.

Memory

(per Node)
Memory:
Slot Count: 16 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.47" (88mm)
Width:
17.68" (449mm)
Depth:
28.75" (730mm)

Front Panel

Buttons:
Power On/Off button
UID button
LEDs:
HDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED

Bios	BIOS Type: AMI 32MB Flash ROM

Onboard Devices

(per Node)
Chipset:
Intel® C741

Network Connectivity:
Via AIOM

IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

(per Node)
Hot-swap:
6x 2.5" hot-swap NVMe/SATA drive bays (2x PCI-E 5.0 NVMe/SATA and 4x PCI-E 4.0 NVMe/SATA)
M.2:
2 M.2 NVMe

Expansion Slots

(per Node)
PCI-Express (PCIe):
2 PCIe 5.0 x16 LP slot(s)

Power Supply

3000W 1U Redundant Power Supply
Total Output Power:
3000W : 208 - 240 Vac
3000W : 240 - 240 Vdc for CQC only

Dimension (W x H x L):
45 x 40 x 480 mm

AC Input:
1400W: 100-127Vac / 50-60Hz
2880W: 200-207Vac / 50-60Hz
3000W: 208-240Vac / 50-60Hz

DC Input:
3000W: 240-240Vdc for CQC only/ 50-60Hz

12V SB:
Max: 4.5A / Min: 0A

Certification:
Titanium Level

Input Output

(per Node)
LAN:
1 RJ45 Dedicated BMC LAN port

USB:
2 USB 3.1 port(s) (2 rear)

Video:
1 VGA port(s)

Others:
2x M.2 for boot drive or caching
M.2 form factor: NVMe double-sided 22x110mm
Note: Enterprise-grade M.2 only for caching application

Cooling

Fans:
4x 16K RPM Counter Rotating 8cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

RoHS:
RoHS Compliant

Details

Management
Software:
Supermicro Out of Band (OOB) License (Included per Node)
SuperCloud Composer
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
IPMI 2.0
SUM
Watch Dog
SuperDoctor® 5
Power Configurations:
ACPI / APM Power Management

SYS-221H-TNR

$8,399.00

CONFIGURE

SKU	SYS-221H-TNR

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)

Memory

Memory:
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Memory Voltage:
1.1 V

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.5" (88.9mm)
Width:
17.2" (437mm)
Depth:
29.9" (760mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
LAN2 activity
Power
Power Fail
System information

Bios	BIOS Type: AMI 256MB SPI Flash

Onboard Devices

HDD Drive Bays

Hot-swap:
8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Configurable option for 16x 2.5" hot-swap NVMe/SAS/SATA drive bays. NVMe, SATA, or SAS support requires additional parts.
M.2:
2 M.2 NVMe OR 2 M.2 SATA3
M-Key, 2280/2210

Expansion Slots

4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)

Power Supply