Supermicro AI Training

Large-Scale AI training demands cutting-edge technologies to maximize parallel computing power of GPUs to handle billions if not trillions of AI model parameters to be trained with massive datasets that are exponentially growing. Leverage NVIDIA’s HGX™ H100 SXM 8-GPU/4-GPU and the fastest NVLink™ & NVSwitch™ GPU-GPU interconnects with up to 900GB/s bandwidth, and fastest 1:1 networking to each GPU for node clustering, these systems are optimized to train large language models from scratch in the shortest amount of time. Completing the stack with all-flash NVMe for a faster AI data pipeline, we provide fully integrated racks with liquid cooling options to ensure fast deployment and a smooth AI training experience.

AI Rack Solutions
Multi-Architecture Flexibility with Future-Proof
Open-Standards-Based Design for POD, and SuperPOD with Liquid Cooling

• Proven AI rack cluster deployment in some of the world’s largest AI clusters

• AI POD, SuperPOD customizable architecture

• Turn-key proven solutions accelerates time to market

• Traditional, free-air and liquid cooled configurations for optimal TCE/TCO

Factory integrated and fully tested multi-rack cluster

• Server, storage, networking, software, management total solutions designed, built and deployed to your specification

• Rack Scale L11/L12 testing and validation

• Factory tuned power and cooling design

• Single source liquid cooling solution available with reduced (weeks) lead time

Title A-Z

Results For: Supermicro AI Training

ARS-111GL-DNHR-LCC

$104,155.00

CONFIGURE

SKU	ARS-111GL-DNHR-LCC

Processor

(per Node)
CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Note:
Supports up to 2000W TDP CPUs (Liquid Cooled)

GPU
Max GPU Count:
Up to 1 onboard GPU
Supported GPU:
NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
View GPU Options
CPU-GPU Interconnect:
NVLink®-C2C
GPU-GPU Interconnect:
PCIe

Memory

Slot Count: Onboard Memory
Max Memory: Up to 480GB ECC LPDDR5X
Additional GPU Memory: Up to 96GB ECC HBM3

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.75" (44 mm)
Width:
17.33" (440 mm)
Depth:
37" (940 mm)

Bios	BIOS Type: AMI 64MB SPI Flash EEPROM

HDD Drive Bays

Default:
Total 4 bays
4 front hot-swap E1.S NVMe drive bays

M.2:
2 M.2 NVMe slots (M-key)

Expansion Slots

Default
2 PCIe 5.0 x16 FHFL slots

Power Supply

2x 2700W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL):
73.5 x 40 x 185 mm

Input:
2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)

+12V:
Max: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)

12V SB:
Max: 4A / Min: 0A

Output Type:
Backplanes (gold finger)

Input Output

(per Node)
LAN:
1 RJ45 1 GbE Dedicated BMC LAN port
USB:
2 ports(rear)
Video:
1 mini-DP port

Cooling

Fans:
7 Removable heavy-duty 4cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

Details

Management
Power configurations:
Power-on mode for AC power recovery
ACPI Power Management

PC Health Monitoring
CPU:
Monitors for CPU Cores, Chipset Voltages, Memory
FAN:
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors

ARS-111GL-NHR

$52,780.00

CONFIGURE

SKU	ARS-111GL-NHR

Processor

CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note:
Supports up to 1000W TDP CPUs (Air Cooled)

Memory

Slot Count: Onboard Memory
Max Memory: Up to 480GB ECC LPDDR5X
Additional GPU Memory: Up to 96GB ECC HBM3

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43.6 mm)
Width:
17.26" (438.4 mm)
Depth:
35.4" (900 mm)

Front Panel

Buttons:
Power On/Off button

Bios	BIOS Type: AMI 64MB SPI Flash EEPROM

HDD Drive Bays

Drive Bays Configuration:
Default: Total 8 bays
8 front hot-swap E1.S NVMe drive bays

M.2:
2 M.2 NVMe slots (M-key)

Expansion Slots

Default
2 PCIe 5.0 x16 FHFL slots

Power Supply

2x 2000W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL):
73.5 x 40 x 185 mm

Input:
1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vac / 50-60Hz
2000W: 230-240Vdc / 50-60Hz (for CQC only)

+12V:

Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)

12V SB:
Max: 3.5A / Min: 0A

Output Type:
Backplanes (gold finger)

Input Output

LAN:
1 RJ45 1 GbE Dedicated BMC LAN port

USB:
1 USB 3.0 port(Rear)

Video:
1 mini-DP port

TPM:
1 TPM Onboard/port 80

Cooling

Fans:
9 Removable heavy-duty 4cm Fan(s)

Operating Environment

Details

Management
Power configurations:
Power-on mode for AC power recovery
ACPI Power Management

AS-8125GS-TNHR

Please Inquire

CONFIGURE

SKU	AS-8125GS-TNHR

Processor

CPU:
Dual Socket SP5
AMD EPYC™ 9004 Series Processors

Core Count:
Up to 128C/256T

Note:
Supports up to 400W TDP CPUs (Air Cooled)

Max GPU Count:
Up to 8 onboard GPU(s)

Supported GPU:
NVIDIA SXM: HGX H100 8-GPU (80GB)

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink® with NVSwitch™

Memory

Memory:
Slot Count: 24 DIMM slots
Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

8U Rackmount Chassis

Dimensions

Height:
14" (355.6 mm)
Width:
17.2" (437 mm)
Depth:
33.2" (843.28 mm)

Front Panel

LED:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Buttons:
Power On/Off button
System Reset button

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:

AMD SP5

NVMe

Network Connectivity

HDD Drive Bays

Drive Bays Configuration:
Default: Total 18 bay(s)
2 front hot-swap 2.5" SATA drive bay(s)
4 front hot-swap 2.5" NVMe drive bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
(NVMe support may require additional storage controller and/or cables)

M.2:
1 M.2 NVMe slot(s) (M-key)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
8 PCIe 5.0 x16 LP slot(s)
2 PCIe 5.0 x16 FHFL slot(s)

Power Supply

1x 3000W Redundant Titanium Level power supply
Dimension (WxHxL):
106.5 x 82.1 x 245.5 mm

+12V:
Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3A / Min: 0A

AC Input:
3000W: 207-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

Input Output

Video:
1 VGA port(s)

Cooling

Fans:
10 heavy duty fans with optimal fan speed control

Operating Environment

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

ASG-1115S-NE316R

Please Inquire

CONFIGURE

SKU	ASG-1115S-NE316R

Processor

CPU:
Single Socket SP5
AMD EPYC™ 9004 Series Processors

Core Count:
Up to 96C/192T

Note:
Supports 200W - 300W TDP CPUs (Air Cooled)

Memory

Memory:
Slot Count: 24 DIMM slots
Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43.6 mm)
Width:
17.2" (438.4 mm)
Depth:
30.4" (773.25 mm)

Front Panel

LED:
Network activity
Power status
SSD activity
System information (overheat/UID)

Buttons:
Power On/Off

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
AMD System on Chip

Network Connectivity:
Via AIOM

NVMe

HDD Drive Bays

Drive Bays Configuration:
Default: Total 16 bay(s)
16 front hot-swap E3.S 1T NVMe drive bay(s)

M.2:
2 M.2 NVMe slot(s) (M-key 2280/22110)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
2 PCIe 5.0 x16 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

M.2:
2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110)

Power Supply

1x 1600W Redundant Titanium Level power supply
Dimension (WxHxL):
73.5 x 40 x 203 mm

+12V:
Max: 133A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 2.1A / Min: 0A

AC Input:
1600W: 200-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

Input Output

LAN:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)

USB:
2 USB 3.0 port(s) (rear)
2 USB 3.0 port(s) (front)

Video:
1 VGA port(s)

Cooling

8 Heavy Duty 4cm Fan(s)

Operating Environment

ROHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (Non-condensing)
Non-operating Relative Humidity: 8% to 95% (Non-condensing)

ASG-2115S-NE332R

Please Inquire

CONFIGURE

SKU	ASG-2115S-NE332R

Processor

CPU:
Single Socket SP5
AMD EPYC™ 9004 Series Processors

Note:
Supports 200W - 360W TDP CPUs (Air Cooled)

Memory

Memory:
Slot Count: 24 DIMM slots
Max Memory (1DPC): Up to 4TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.5" (89.8 mm)
Width:
17.2" (438.4 mm)
Depth:
30.8" (789.9 mm)

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
AMD System on Chip

Network Connectivity:
Via AIOM

HDD Drive Bays

Drive Bays Configuration:
Default: Total 34 bay(s)
32 front hot-swap E3.S 1T NVMe drive bay(s)
2 rear hot-swap 2.5" SATA drive bay(s)

M.2:
2 M.2 NVMe slot(s) (M-key 2280/22110)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
2 PCIe 5.0 x16 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

M.2:
2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110)

Power Supply

1x 2000W Redundant Titanium Level power supply
Dimension (WxHxL):
73.5 x 40 x 203 mm

+12V:
Max: 166A / Min: 0A (230Vac-240Vac)

12V SB:
Max: 3.5A

AC Input:
2000W: 230-240Vdc / 50-60Hz (for China only)

Output Type:
Backplanes (gold finger)

Input Output

LAN:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)

USB:
2 USB 3.0 port(s) (rear)
2 USB 3.0 port(s) (front)

Video:
1 VGA port(s)

Cooling

4 Heavy Duty 8cm Fan(s)

Operating Environment

ROHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (Non-Condensing)
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)

SSG-121E-NE316R

$9,492.00

CONFIGURE

SKU	SSG-121E-NE316R

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Note:
Supports 145W - 270W TDP CPUs (Air Cooled)

Memory

Memory:
Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

1U rackmount Chassis

Dimensions

Height:
1.7" (43.6 mm)
Width:
17.2" (438.4 mm)
Depth:
30.4" (773.25 mm)

Front Panel

LED:
Network activity
Power status
SSD activity
System information (overheat/UID)

Buttons:
Power On/Off

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
Intel® C741

Network Connectivity:
Via AIOM

NVMe

HDD Drive Bays

Drive Bays Configuration:
Default: Total 16 bay(s)
16 front hot-swap E3.S 1T NVMe drive bay(s)

M.2:
2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
2 PCIe 5.0 x16 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

Power Supply

1x 1600W Redundant Titanium Level power supply
Dimension (WxHxL):
73.5 x 40 x 203 mm

+12V:
Max: 133A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 2.1A / Min: 0A

AC Input:
1600W: 200-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

Input Output

LAN:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)

USB:
2 USB 3.0 port(s) (rear)
2 USB 3.0 port(s) (front)

Video:
1 VGA port(s)

Cooling

8 Heavy Duty 4cm Fan(s)

Operating Environment

ROHS:
RoHS Compliant

SSG-121E-NES24R

Please Inquire

CONFIGURE

SKU	SSG-121E-NES24R

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Note:
Supports 145W - 270W TDP CPUs (Air Cooled)

Memory

Memory:
Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43.6 mm)
Width:
17.2" (438.4 mm)
Depth:
30.4" (773.25 mm)

Front Panel

LED:
Network activity
Power status
SSD activity
System information (overheat/UID)

Buttons:
Power On/Off

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:

Intel® C741

Network Connectivity:

Via AIOM

NVMe

HDD Drive Bays

Drive Bays Configuration:
Default: Total 24 bay(s)
24 front hot-swap E1.S NVMe drive bay(s)

M.2:
2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
2 PCIe 5.0 x16 FHFL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

Power Supply

1x 2000W Redundant Titanium Level power supply
Dimension (WxHxL):
73.5 x 40 x 203 mm

+12V:
Max: 166A / Min: 0A (230Vac-240Vac)

12V SB:
Max: 3.5A

AC Input:
2000W: 230-240Vdc / 50-60Hz (for China only)

Output Type:
Backplanes (gold finger)

Input Output

LAN:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)

USB:
2 USB 3.0 port(s) (rear)
2 USB 3.0 port(s) (front)

Video:
1 VGA port(s)

Cooling

Fans:
8 Heavy Duty 4cm Fan(s)

Operating Environment

ROHS:
RoHS Compliant

SSG-221E-NE324R

Please Inquire

CONFIGURE

SKU	SSG-221E-NE324R

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Note:
Supports 145W - 350W TDP CPUs (Air Cooled)

Memory

Memory:
Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.5" (89.8 mm)
Width:
17.2" (438.4 mm)
Depth:
30.8" (789.9 mm)

Onboard Devices

Chipset:
Intel® C741

Network Connectivity:
Via AIOM

NVMe

HDD Drive Bays

Drive Bays Configuration:
Default: Total 24 bay(s)
24 front hot-swap E3.S 1T NVMe drive bay(s)

M.2:
2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
4 PCIe 5.0 x8 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Option A
2 PCIe 5.0 x8 FHHL slot(s)
1 PCIe 5.0 x16 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Option B
2 PCIe 5.0 x16 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

Power Supply

1x 2000W Redundant Titanium Level power supply
Dimension (WxHxL):
73.5 x 40 x 203 mm

+12V:
Max: 166A / Min: 0A (230Vac-240Vac)

12V SB:
Max: 3.5A

AC Input:
2000W: 230-240Vdc / 50-60Hz (for China only)

Output Type:
Backplanes (gold finger)

Cooling

4 Heavy Duty 8cm Fan(s)

Operating Environment

ROHS:
RoHS Compliant

SYS-121H-TNR

$9,380.00

CONFIGURE

SKU	SYS-121H-TNR

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
Air Cooled CPUs with TDP over 250W only supported under specific conditions.

Memory

Memory：
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Memory Voltage：
1.1 V

Chassis

1U Rackmount Chassis

Dimensions

Height:
1.7" (43mm)
Width:
17.2" (437mm)
Depth:
29.4" (747mm)

Front Panel

Buttons:
Power On/Off
UID button
LEDs:
HDD activity
LAN1 activity
Power
System information

Bios	BIOS Type: AMI 256MB SPI Flash

Onboard Devices

SATA:
SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe:
NVMe; RAID 0/1/5/10 support (Intel® VROC RAID key required)
Chipset:
Intel® C741
Network Connectivity:
2x 1GbE BaseT with Intel® i350-AM2 (optional)
4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
2x 10GbE BaseT with Intel® X550-AT2 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:

8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Configurable option for 12x 2.5" hot-swap NVMe/SAS/SATA drive bays. NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)

M.2:

2 M.2 NVMe OR 2 M.2 SATA3

M-Key, 2280/2210

Expansion Slots

1 PCIe 5.0 x16 FH, 6.6"L slot(s)
2 PCIe 5.0 x16 FH, 10.5"L slot(s)

Power Supply

1U 800W/1200W Redundant Titanium CRPS w/PMBus power supply, W73.5xH40xL265mm
Dimension (W x H x L):
73.5 x 40 x 265 mm
AC Input:
800W: 100-127Vac / 9.8A-7A / 50-60Hz
1200W: 200-240Vac / 7.5A-6A / 50-60Hz
+12V:
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
25 Pairs Gold Finger Connector
Certification:
Titanium Level

Input Output

LAN:
1 RJ45 Dedicated BMC LAN port
USB:
1 USB 3.0 port(s) (1 front)
2 USB 2.0 port(s) (2 rear)
Video:
1 VGA port(s)

Cooling

Fans:
8x 4cm heavy duty fans with optimal fan speed control
Air Shroud:
2 Air Shroud(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

Details

Management
Software:
Redfish API
IPMI 2.0
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Watch Dog
SuperDoctor® 5
Power Configurations:
Power-on mode for AC power recovery
ACPI Power Management

SYS-221BT-DNTR

$10,145.00

CONFIGURE

SKU	SYS-221BT-DNTR

Processor

(per Node)

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)

Memory

(per Node)
Memory:
Slot Count: 16 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.47" (88mm)
Width:
17.68" (449mm)
Depth:
28.75" (730mm)

Front Panel

Buttons:
Power On/Off button
UID button

LEDs:
HDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED

Bios	BIOS Type: AMI 32MB Flash ROM

Onboard Devices

(per Node)
Chipset:
Intel® C741

Network Connectivity:
Via AIOM

IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

(per Node)
Hot-swap:
12x 2.5" hot-swap NVMe/SATA drive bays (2x PCI-E 5.0 NVMe/SATA and 10x PCI-E 4.0 NVMe/SATA)
M.2:
2 M.2 NVMe

Expansion Slots

(per Node)
PCI-Express (PCIe):
2 PCIe 5.0 x8 LP slot(s)
1 PCIe 5.0 x16 LP slot(s)

Power Supply

2200W Redundant Power Supplies with PMBus
Total Output Power:
2200W : 100 - 240 Vac
2090W : 230 - 240 Vdc for CCC only

Dimension (W x H x L):
45 x 40 x 480 mm

AC Input:
1200W: 100-127Vac / 50-60Hz
2090W: 180-220Vac (for UL/cUL only)
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2200W: 220-240Vac (for UL/cUL only)
2090W: 230-240Vac / 50-60Hz
2090W: 230-240Vdc (for CCC only)

+12V:
Max: 100A / Min: 0A (100-127Vac)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)

12V SB:
Max: 2.1A / Min: 0A

Certification:
Titanium Level

Input Output

(per Node)
LAN:
1 RJ45 Dedicated BMC LAN port

USB:
2 USB 3.1 port(s) (2 rear)

Video:
1 VGA port(s)

Others:
2x M.2 for boot drive or caching
M.2 form factor: NVMe double-sided 22x110mm
Note: Enterprise-grade M.2 only for caching application

Cooling

Fans:
4x 16.5K RPM Heavy Duty 8cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

RoHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (Non-Condensing)
Non-operating Relative Humidity:
5% to 95% (Non-Condensing)

Details

Management
Software:
Supermicro Out of Band (OOB) License (Included per Node)
SuperCloud Composer
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
IPMI 2.0
SUM
Watch Dog
SuperDoctor® 5

Power Configurations:
ACPI / APM Power Management

SYS-221BT-HNTR

$13,033.00

CONFIGURE

SKU	SYS-221BT-HNTR

Processor

(per Node)

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 205W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
Air Cooled CPUs with TDP over 205W only supported under specific conditions.

Memory

(per Node)
Memory:
Slot Count: 16 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.47" (88mm)
Width:
17.68" (449mm)
Depth:
28.75" (730mm)

Front Panel

Buttons:
Power On/Off button
UID button
LEDs:
HDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED

Bios	BIOS Type: AMI 32MB Flash ROM

Onboard Devices

(per Node)
Chipset:
Intel® C741

Network Connectivity:
Via AIOM

IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

(per Node)
Hot-swap:
6x 2.5" hot-swap NVMe/SATA drive bays (2x PCI-E 5.0 NVMe/SATA and 4x PCI-E 4.0 NVMe/SATA)
M.2:
2 M.2 NVMe

Expansion Slots

(per Node)
PCI-Express (PCIe):
2 PCIe 5.0 x16 LP slot(s)

Power Supply

3000W 1U Redundant Power Supply
Total Output Power:
3000W : 208 - 240 Vac
3000W : 240 - 240 Vdc for CQC only

Dimension (W x H x L):
45 x 40 x 480 mm

AC Input:
1400W: 100-127Vac / 50-60Hz
2880W: 200-207Vac / 50-60Hz
3000W: 208-240Vac / 50-60Hz

DC Input:
3000W: 240-240Vdc for CQC only/ 50-60Hz

12V SB:
Max: 4.5A / Min: 0A

Certification:
Titanium Level

Input Output

(per Node)
LAN:
1 RJ45 Dedicated BMC LAN port

USB:
2 USB 3.1 port(s) (2 rear)

Video:
1 VGA port(s)

Others:
2x M.2 for boot drive or caching
M.2 form factor: NVMe double-sided 22x110mm
Note: Enterprise-grade M.2 only for caching application

Cooling

Fans:
4x 16K RPM Counter Rotating 8cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

RoHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (Non-Condensing)
Non-operating Relative Humidity:
5% to 95% (Non-Condensing)

Details

Management
Software:
Supermicro Out of Band (OOB) License (Included per Node)
SuperCloud Composer
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
IPMI 2.0
SUM
Watch Dog
SuperDoctor® 5
Power Configurations:
ACPI / APM Power Management

SYS-241E-TNRTTP

$12,128.00

CONFIGURE

SKU	SYS-241E-TNRTTP

Processor

CPU:
Quad Socket E (LGA-4677)
4th Gen Intel® Xeon® Scalable processors

Note:
Supports 165W - 250W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)

Memory

Slot Count: 64 DIMM slots
Max Memory (2DPC): Up to 8TB 4800MT/s ECC DDR5 RDIMM

Chassis

2U Rackmount Chassis

Dimensions

Height:
3.5" (87.9mm)
Width:
17.3" (438.4mm)
Depth:
33.4" (849.3mm)

Front Panel

Buttons:
Power On/Off
UID
LEDs:
HDD activity
Network activity
Power status
System information (overheat/UID)

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
Intel® C741
Network Connectivity:
Via AIOM
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
24x 2.5" hot-swap NVMe/SAS3/SATA3 drive bays (24x 2.5" NVMe hybrid) (Default 8x SATA3 drive bays. NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)

M.2:
2 M.2 NVMe OR 2 M.2 SATA3

Expansion Slots

3 PCIe 5.0 x8 FHFL slot(s)
1 PCIe 5.0 x16 FHFL slot(s)
2 PCIe 5.0 x16 FHHL slot(s)
1 PCIe 5.0 x16 AIOM slot(s)
1 PCIe 5.0 x8 AIOM slot(s)

Power Supply

1U 1600W Redundant Titanium AC Power Supply with PMbus 73.5x203x40mm
Dimension (W x H x L):
73.5 x 40 x 203 mm

AC Input:
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac / 50-60Hz

+12V:
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 133A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 2.1A / Min: 0A

Output Type:
Gold Finger Connector

Certification:
Titanium Level

Input Output

LAN:
1 RJ45 Dedicated IPMI LAN port

USB:
2 USB 2.0 port(s) (2 front)
2 USB 3.0 port(s) (2 rear)

Video:
1 VGA port(s)
1 DisplayPort (s)

Serial Port:
1 COM Port(s) (1 rear)

Cooling

6 Heavy duty counter-rotating 6cm Fan(s)

Operating Environment

RoHS:
RoHS Compliant

Environmental Spec.:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (Non-Condensing)
Non-operating Relative Humidity:
5% to 95% (Non-Condensing)

Details

Management
Software:
IPMI 2.0
SSM
Intel® Node Manager
SPM
SUM
NMI
Watch Dog
SuperDoctor® 5
Power Configurations:
ACPI Power Management
Power-on mode for AC power recovery

SYS-421GE-TNHR2-LCC

$342,524.00

CONFIGURE

SKU	SYS-421GE-TNHR2-LCC

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)

Core Count:
64C/128T; 320MB Cache per CPU

Note:
Supports up to 385W TDP CPUs (Liquid Cooled)

GPU
Max GPU Count:
Up to 8 onboard GPUs

Supported GPU:
NVIDIA SXM: HGX H100 8-GPU (80GB), HGX H200 8-GPU (141GB)

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink® with NVSwitch™

Certification:
Nvidia Certified

Memory

Slot Count: 32 DIMM slots
Max Memory (1DPC): 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): 8TB 4400MT/s ECC DDR5 RDIMM

Chassis

4U Rackmount Chassis

Dimensions

Height:
6.85" (174 mm)
Width:
17.7" (449 mm)
Depth:
33.2" (842 mm)

Front Panel

Buttons:
UID button

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
Intel® C741

Network Connectivity:
2 SFP28 25GbE with Broadcom® BCM57414 (optional)
2 RJ45 10GbE with Intel® X710-AT2 (optional)

HDD Drive Bays

Drive Bays Configuration

Default:

Total 8 bays

8 front hot-swap 2.5" NVMe drive bays

M.2:

2 M.2 NVMe slots (M-key)

Expansion Slots

Default
8 PCIe 5.0 x16 LP slots
2 PCIe 5.0 x16 FHHL slots
Option A
8 PCIe 5.0 x16 LP slots
4 PCIe 5.0 x16 FHHL slots

Power Supply

4x 5250W Redundant Titanium (certification pending) Level (96%) power supplies
Dimension (WxHxL):
106.5 x 82.1 x 245.3 mm

AC Input:
5250W: 200-240Vac / 50-60Hz

+12V:
Max: 125A / Min: 0A (200Vac-240Vac)

Output Type:
Backplanes (gold finger)

Certification:
Titanium (certification pending) Level

Input Output

Video:
1 VGA port

Cooling

Fans:
4 Fan 8cm Fan(s)

Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

Details

Management
Software:
SuperCloud Composer
Supermicro Server Manager (SSM)
Supermicro Update Manager (SUM)
Supermicro SuperDoctor® 5 (SD5)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power configurations:
Power-on mode for AC power recovery
ACPI Power Management

Security
Hardware:
Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features:
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown

PC Health Monitoring
CPU:
Monitors for CPU Cores, Chipset Voltages, Memory
8+4 Phase-switching voltage regulator
FAN:
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors

SYS-421GE-TNRT

$120,707.00

CONFIGURE

SKU	SYS-421GE-TNRT

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 385W TDP CPUs (Liquid Cooled)

Max GPU Count:
Up to 10 double-width or 10 single-width GPU(s)

Supported GPU:
NVIDIA PCIe: H100, L40, RTX A4000, RTX 6000 ADA, L40S, A100, A10
Intel PCIe: Data Center GPU Max 1100

CPU-GPU Interconnect:
PCIe 5.0 x16 Switch Dual-Root

GPU-GPU Interconnect:
NVIDIA® NVLink® Bridge (optional), Intel® Xe Link Bridges

Memory

Memory:
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Memory Voltage:
1.1 V

Chassis

4U Rackmount Chassis

Dimensions

Height:
7" (178mm)
Width:
17.2" (437mm)
Depth:
29" (737mm)

Front Panel

Buttons:
Power On/Off button
System Reset button

LEDs:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
Intel® C741

Network Connectivity:
2x 10GbE BaseT with Intel® X710-AT2

IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

HDD Drive Bays

Hot-swap:
24x 2.5" hot-swap NVMe/SATA/SAS drive bays (8x 2.5" NVMe hybrid; 8x 2.5" NVMe dedicated)

M.2:
2 M.2 NVMe

Expansion Slots

12 PCIe 5.0 x16 LP slot(s)
1 PCIe 5.0 X16 slot(s)

Power Supply

2700W, Titanium efficiency, Redundant w/PMBus power supply, W73.5xH39/40xL203 mm, C20 inlet
Dimension (W x H x L):
73.5 x 40 x 203 mm

AC Input:
2700W: 200-240Vac / 50-60Hz

+12V:
Max: 225A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3.5A / Min: 0A

Output Type:
25 Pairs Gold Finger Connector

Certification:
Titanium Level

Input Output

Video:
1 VGA port(s)

Cooling

Fans:
8 heavy duty fans with optimal fan speed control

Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)

Details

Management
Software:
OOB Management Package (SFT-OOB-LIC )
Redfish API
IPMI 2.0
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Watch Dog
SuperDoctor® 5
Power Configurations:
ACPI Power Management
Power-on mode for AC power recovery

SYS-421GU-TNXR

$6,585.00

CONFIGURE

SKU	SYS-421GU-TNXR

Processor

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Core Count:
Up to 56C/112T; Up to 112.5MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)

Max GPU Count:
Up to 4 onboard GPU(s)

Supported GPU:
NVIDIA SXM: HGX H100 4-GPU (80GB)
View GPU Options

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink®

Certification:
NVIDIA Certified

Memory

Slot Count: 32 DIMM slots

Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5

Memory Voltage

1.1V

Chassis

4U Rackmount Chassis

Dimensions

Height:
7" (175.6 mm)
Width:
17.67" (449 mm)
Depth:
32.79" (833 mm)

Front Panel

LED:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Buttons:
Power On/Off button
System Reset button

Bios	BIOS Type: AMI 32MB SPI Flash EEPROM

Onboard Devices

Chipset:
Intel® C741

Network Connectivity:
2 RJ45 10GbE with Intel® X710-AT2

NVMe

HDD Drive Bays

Drive Bays Configuration:
Default: Total 6 bay(s)
6 front hot-swap 2.5" NVMe/SATA drive bay(s)

M.2:
2 M.2 NVMe/SATA slot(s) (M-key)

Expansion Slots

PCI-Express (PCIe) Configuration:
Default
1 PCIe 5.0 x16 LP slot(s)
7 PCIe 5.0 x16 LP slot(s)

Power Supply

4x 3000W Redundant Titanium Level power supplies
Dimension (WxHxL):
106.5 x 82.1 x 245.5 mm

+12V:
Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3A / Min: 0A

AC Input:
3000W: 0240Vdc / 50-60Hz (for CQC only)
2880W: 200-207Vac / 50-60Hz
3000W: 207-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

Input Output

Video:
1 VGA port(s)

Cooling

Fans:
5 heavy duty fans with optimal fan speed control

Air Shroud:
1 Air Shroud(s)

Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)

Operating Environment

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