CALL TODAYLOGINCart(0)$0.00

AI Cloud

 
 
 
Proven high-performance storage architectures to support AI and ML workloads
 
 
 
Proven reference architectures for AI and ML data-intensive workloads integrated with leading software defined storage ISVs including Weka.io, Quantum ActiveScale, Cloudian, OSNexus and Scality. Optimal storage architecture balances both flash-based parallel file system high-performance storage and capacity-optimized object storage for large-capacity, less–frequently-accessed storage.
Maximize your investment in AI GPU systems by keeping AI data pipelines fully saturated using high-performance Supermicro 2U all-flash Petascale servers. These systems have industry-leading capacity and performance using native PCIe Gen 5 performance with a symmetrical I/O design enabled by the AMD EPYC™ 9004 series CPU with 32 E3.S drives providing 480 TB capacity.
Supermicro provides complete rack integration to shorten time-to-value for on-site deployment enabled by Supermicro SuperCloud Composer which provides automated provisioning.
Supermicro offers complete, proven reference storage architectures optimized for performance and capacity to support data intensive workloads including AI, machine learning, HPC, and analytics. These solutions are deployed on Supermicro’s AMD-powered Petascale servers which have an industry leading 32 E3.S drives enabling up to 480 TB of all-flash storage.
 
 
 
 
 

 
 
 
 
Cloud computing relies on sharing of resources to achieve coherence and economies of scale, similar to a utility (like the electricity grid) over a network. At the foundation of cloud computing is the broader concept of converged infrastructure and shared services.
 
The cloud also focuses on maximizing the effectiveness of the shared resources. Cloud resources are usually not only shared by multiple users but are also dynamically reallocated per demand. This can work for allocating resources to users. For example, a cloud computer facility that serves European users during European business hours with a specific application (e.g., email) may reallocate the same resources to serve North American users during North America's business hours with a different application (e.g., a web server). This approach should maximize the use of computing power thus reducing environmental damage as well since less power, air conditioning, rackspace, etc. are required for a variety of functions. With cloud computing, multiple users can access a single server to retrieve and update their data without purchasing licenses for different applications.
 
The term "moving to cloud" also refers to an organization moving away from a traditional CAPEX model (buy the dedicated hardware and depreciate it over a period of time) to the OPEX model (use a shared cloud infrastructure and pay as one uses it).
 
Proponents claim that cloud computing allows companies to avoid upfront infrastructure costs, and focus on projects that differentiate their businesses instead of infrastructure. Proponents also claim that cloud computing allows enterprises to get their applications up and running faster, with improved manageability and less maintenance, and enables IT to more rapidly adjust resources to meet fluctuating and unpredictable business demand. Cloud providers typically use a "pay as you go" model. This can lead to unexpectedly high charges if administrators do not adapt to the cloud pricing model.
 
 

 
 
We offer the most appropriate Cloud computing solutions for your business need. Call Now 1-800-5628650 or Click the "Quote Form" button to get a detail solution quote. 
 
  • AS-1125HS-TNR
    AS-1125HS-TNR
    $6,657.00
    SKU
    AS-1125HS-TNR 
    Processor
    CPU:
    Dual Socket SP5
    4th Generation AMD EPYC™ 9004 Series Processor
    Support CPU TDP up to 360W 
    Cores:
    Up to 192C/384T
    Note:
    Certain CPUs with high TDP may be supported only under specific conditions. Please contact our Technical Support for additional information about specialized system optimization
     
    Memory
    Memory:
    Memory Capacity: 24 DIMM slots
    Up to 6TB: 3DS ECC Registered RDIMM, DDR5-4800MHz
    Memory Type: 4800MHz ECC DDR5 RDIMM Up to 512GB of memory
    Note:
    For optimal performance AMD recommends full memory population
    Memory Voltage:
    1.1 V
    Error Detection:
    Corrects single-bit errors Detects double-bit errors (using ECC memory)
     
    Chassis
    1U Rackmount Chassis
     
    Dimensions
    Height:
    1.7" (43mm)
    Width:
    17.2" (437mm)
    Depth:
    29.4" (747mm)
     
    Front Panel
    Buttons:
    Power On/Off
    UID button
    LEDs:
    HDD activity
    LAN1 activity
    Power status
    System information
     
    Bios
    BIOS Type:
    AMI 256MB SPI Flash
    BIOS Features:
    ACPI 6.4
    Plug and Play (PnP)
    SMBIOS 3.5 or later
    UEFI 2.8
    USB Keyboard support
     
    Onboard Devices
    Chipset:
    System on Chip
    Network Connectivity:
    Via AIOM
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Up to 12x 2.5" hot-swap NVMe/SATA/SAS support with additional parts)
    M.2:
    2x NVMe (PCIe 3.0 x4, Boot drive only)
    M-Key, 2280/22110
     
    Expansion Slots
    1 PCIe 5.0 x16 FH, 6.6"L slot(s)
    2 PCIe 5.0 x16 FH, 10.5"L slot(s)
     
    Power Supply
    1U 800W/1200W Redundant Titanium CRPS w/PMBus power supply
    Dimension(W x H x L):
    73.5 x 40 x 265 mm
    AC Input:
    800W: 100-127Vac / 9.8A-7A / 50-60Hz
    1200W: 200-240Vac / 7.5A-6A / 50-60Hz
    +12V:
    Max: 83A / Min: 0A (100Vac-127Vac)
    Max: 100A / Min: 0A (200Vac-240Vac)
    12V SB:
    Max: 2.1A / Min: 0A
    Output Type:
    25 Pairs Gold Finger Connector
    Certification:
    Titanium Level
     
    Input Output
    LAN:
    1 Dedicated IPMI LAN port
    USB:
    3 USB 3.0 port(s) (1 front; 2 rear)
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    8x 4cm heavy duty fans with optimal fan speed control
    Air Shroud:
    2x Air Shroud(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
    Note:
    Operating Temperature based on configurations 
     
  • AS-2025HS-TNR
    AS-2025HS-TNR
    $7,520.00
    SKU
    AS-2025HS-TNR 
    Processor
    CPU:
    Dual Socket SP5
    4th Generation AMD EPYC™ 9004 Series Processor
    Support CPU TDP up to 360W
    Cores:
    Up to 192C/384T
    Note:
    Certain CPUs with high TDP may be supported only under specific conditions. Please contact our Technical Support for additional information about specialized system optimization
     
    Memory
    Memory:
    Memory Capacity: 24 DIMM slots
    Up to 6TB: 3DS ECC Registered RDIMM, DDR5-4800MHz
    Memory Type: 4800MHz ECC DDR5 RDIMM Up to 512GB of memory
    Note:
    For optimal performance AMD recommends full memory population
    Memory Voltage:
    1.1 V
    Error Detection:
    Corrects single-bit errors Detects double-bit errors (using ECC memory)
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88.9mm)
    Width:
    17.2" (437mm)
    Depth:
    31.6" (803mm)
     
    Front Panel
    Buttons:
    Power On/Off
    UID button
    LEDs:
    HDD activity
    LAN1 activity
    Power status
    System information
     
    Bios
    BIOS Type:
    AMI 256MB SPI Flash
    BIOS Features:
    ACPI 6.4
    Plug and Play (PnP)
    SMBIOS 3.5 or later
    UEFI 2.8
    USB Keyboard support
     
    Onboard Devices
    Chipset:
    System on Chip
    Network Connectivity:
    Via AIOM
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    12x 3.5" hot-swap NVMe/SATA/SAS drive bays
    M.2:
    2x NVMe (PCIe 3.0 x4, Boot drive only)
    M-Key, 2280/22110
     
    Expansion Slots
    4x (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
    4x (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)
     
    Power Supply
    1600W 1U redundant power supply
    Dimension (W x H x L):
    73.5 x 40 x 265 mm
    AC Input:
    1000W: 100-127Vac / 12A-9A / 50-60Hz
    1600W: 200-240Vac / 9A-7.5A / 50-60Hz
    +12V:
    Max: 83.3A / Min: 0A (100Vac-127Vac)
    Max: 133.3A / Min: 0A (200Vac-240Vac)
    12V SB:
    Max: 3.5A / Min: 0A
    Output Type:
    25 Pairs Gold Finger Connector
    Certification:
    Titanium Level
     
    Input Output
    LAN:
    1 Dedicated IPMI LAN port
    USB:
    2 USB 3.0 port(s) (2 rear)
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    4x 8cm heavy duty fans with optimal fan speed control
    Air Shroud:
    2 Air Shroud(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
    Note:
    Operating Temperature based on configurations 
     
  • AS-2115GT-HNTF
    AS-2115GT-HNTF
    Please Inquire
    SKU
    AS-2115GT-HNTF 
    Processor
    (per Node)
    CPU:
    Single Socket SP5
    AMD EPYC™ 9004 Series Processor
    Support CPU TDP up to 360W
    Note:
    Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
     
    Memory
    (per Node)
    Memory:
    Memory Capacity: 12 DIMM slots
    Up to 3TB: 12x 256 GB DRAM
    Memory Type: 4800MHz ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.46" (88mm)
    Width:
    17.67" (449mm)
    Depth:
    28" (711.2mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button
    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
    (per Node)
    Chipset:
    AMD SP5
    Network Connectivity:
    Via IO Module
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    4x 2.5" hot-swap NVMe/SATA drive bays (4x 2.5" NVMe hybrid)
    M.2:
    2 M.2 NVMe OR 2 M.2 SATA3
     
    Expansion Slots
    (per Node)
    PCI-Express (PCIe):
    1 PCIe 5.0 x16 LP slot(s)
     
    Power Supply
    Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus
    Dimension (W x H x L):
    106 x 84 x 245 mm
    AC Input:
    100-127Vdc (1200W for the Rest of the World)
    200-220Vdc (1800W for the Rest of the World)
    200-220Vdc (2090W for North America - UL & cUL)
    220-230Vdc (1980W for the Rest of the World)
    220-240Vdc (2200W for North America - UL & cUL)
    230-240Vdc (2090W for the Rest of the World)
    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port
    USB:
    2 USB 3.0 port(s) (2 USB)
    Video:
    1 VGA port(s)
     
    Cooling
    Air Shroud:
    1 per node Air Shroud(s)
    Fans:
    2x 17.6K RPM Heavy Duty 8cm Fan(s)
     
    Operating Environment
    RoHS:
    RoHS Compliant
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -30°C to 60°C (-22°F to 140°F)
    Operating Relative Humidity:
       8% to 80% (non-condensing)
    Non-operating Relative Humidity:
       8% to 90% (non-condensing)
     
  • AS-2115GT-HNTR
    AS-2115GT-HNTR
    Please Inquire
    SKU
    AS-2115GT-HNTR 
    Processor
    (per Node)
    CPU:
    Single Socket SP5
    AMD EPYC™ 9004 Series Processor
    Support CPU TDP up to 290W 
    Note:
    Certain CPUs with high TDP may be supported only under specific conditions. Please contact our Technical Support for additional information about specialized system optimization
     
    Memory
    (per Node)
    Memory:
    Memory Capacity: 12 DIMM slots
    Up to 3TB: 12x 256 GB DRAM
    Memory Type: 4800MHz ECC DDR5 RDIMM
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.46" (88mm)
    Width:
    17.67" (449mm)
    Depth:
    28" (711.2mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    UID button
    LEDs:
    HDD activity LED
    Network activity LEDs
    Power status LED
    Universal Information (UID) LED
     
    Bios
    BIOS Type:
    AMI 32MB Flash ROM
     
    Onboard Devices
    (per Node)
    Chipset:
    AMD SP5
    Network Connectivity:
    Via IO Module
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    (per Node)
    Hot-swap:
    6x 2.5" hot-swap NVMe/SATA drive bays (6x 2.5" NVMe hybrid)
    M.2:
    2 M.2 NVMe OR 2 M.2 SATA3
     
    Power Supply
    Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus
    Dimension (W x H x L):
    106 x 84 x 245 mm
    AC Input:
    100-127Vdc (1200W for the Rest of the World)
    200-220Vdc (1800W for the Rest of the World)
    200-220Vdc (2090W for North America - UL & cUL)
    220-230Vdc (1980W for the Rest of the World)
    220-240Vdc (2200W for North America - UL & cUL)
    230-240Vdc (2090W for the Rest of the World)
    Certification:
    Titanium Level
     
    Input Output
    (per Node)
    LAN:
    1 RJ45 Dedicated BMC LAN port
    USB:
    2 USB 3.0 port(s) (2 USB)
    Video:
    1 VGA port(s)
     
    Cooling
    Air Shroud:
    1 per node Air Shroud(s)
    Fans:
    2x 17.6K RPM Heavy Duty 8cm Fan(s)
     
    Operating Environment
    RoHS:
    RoHS Compliant
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -30°C to 60°C (-22°F to 140°F)
    Operating Relative Humidity:
       8% to 80% (non-condensing)
    Non-operating Relative Humidity:
       8% to 90% (non-condensing)
     
  • AS-2125HS-TNR
    AS-2125HS-TNR
    $7,777.00
    SKU
    AS-2125HS-TNR 
    Processor
    CPU:
    Dual Socket SP5
    4th Generation AMD EPYC™ 9004 Series Processor
    Support CPU TDP up to 360W
    Cores:
    Up to 192C/384T
    Note:
    Certain CPUs with high TDP may be supported only under specific conditions. Please contact our Technical Support for additional information about specialized system optimization
     
    Memory
    Memory:
    Memory Capacity: 24 DIMM slots
    Up to 6TB: 3DS ECC Registered RDIMM, DDR5-4800MHz
    Memory Type: 4800MHz ECC DDR5 RDIMM Up to 512GB of memory
    Note:
    For optimal performance AMD recommends full memory population
    Memory Voltage:
    1.1 V
    Error Detection:
    Corrects single-bit errors Detects double-bit errors (using ECC memory)
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (88.9mm)
    Width:
    17.2" (437mm)
    Depth:
    29.9" (760mm)
     
    Front Panel
    Buttons:
    Power On/Off
    UID button
    LEDs:
    HDD activity
    LAN1 activity
    Power status
    System information
     
    Bios
    BIOS Type:
    AMI 256MB SPI Flash
    BIOS Features:
    ACPI 6.4
    Plug and Play (PnP)
    SMBIOS 3.5 or later
    UEFI 2.8
    USB Keyboard support
     
    Onboard Devices
    Chipset:
    System on Chip
    Network Connectivity:
    Via AIOM
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    24x 2.5" hot-swap NVMe/SATA/SAS drive bays
    M.2:
    2x NVMe (PCIe 3.0 x4, Boot drive only)
    M-Key, 2280/22110
     
    Expansion Slots
    4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
    4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)
     
    Power Supply
    1600W 1U redundant power supply
    Dimension (W x H x L):
    73.5 x 40 x 265 mm
    AC Input:
    1000W: 100-127Vac / 12A-9A / 50-60Hz
    1600W: 200-240Vac / 9A-7.5A / 50-60Hz
    +12V:
    Max: 83.3A / Min: 0A (100Vac-127Vac)
    Max: 133.3A / Min: 0A (200Vac-240Vac)
    12V SB:
    Max: 3.5A / Min: 0A
    Output Type:
    25 Pairs Gold Finger Connector
    Certification:
    Titanium Level
     
    Input Output
    LAN:
    1 Dedicated IPMI LAN port
    USB:
    2 USB 3.0 port(s) (2 rear)
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    4x 8cm heavy duty fans with optimal fan speed control
    Air Shroud:
    2 Air Shroud(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
    Note:
    Operating Temperature based on configurations 
     
  • ASG-2015S-E1CR24H
    ASG-2015S-E1CR24H
    Please Inquire
    SKU
    ASG-2015S-E1CR24H 
    Processor
    CPU:
    Single Socket SP5
    AMD EPYC™ 9004 Series Processors

    Core Count:
    Up to 84C/168T; Up to 384MB Cache

    Note:
    Supports 200W - 290W TDP CPUs (Air Cooled)
     
    Memory
    Memory:
    Slot Count: 12 DIMM slots
    Max Memory (2DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    2U Rackmount chassis
     
    Dimensions
    Height:
    3.5"
    Width:
    17.2"
    Depth:
    34"
     
    Front Panel
    LED:
    Network activity
    Power status
    SSD activity
    System information (overheat/UID) 

    Buttons:
    Power On/Off 
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    System on Chip
    Network Connectivity:
    Via AIOM

    NVMe
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 26 bay(s)
    12 front hot-swap 3.5" SAS/SATA drive bay(s)
    12 top-loading hot-swap 3.5" SAS/SATA drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)
    Option A: Total 28 bay(s)
    12 front hot-swap 3.5" SAS/SATA drive bay(s)
    12 top-loading fixed 3.5" SAS/SATA drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)
    2 rear hot-swap 2.5" NVMe drive bay(s)
    Option B: Total 30 bay(s)
    12 front hot-swap 3.5" SAS/SATA drive bay(s)
    12 top-loading hot-swap 3.5" SAS/SATA drive bay(s)
    4 rear hot-swap 2.5" NVMe drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)

    M.2:
    2 M.2 NVMe slot(s) (M-key 2280/22110)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    5 PCIe 5.0 x16 FHHL slot(s)
    1 PCIe 5.0 x8 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option A
    3 PCIe 5.0 x16 FHHL slot(s)
    1 PCIe 5.0 x8 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option B
    2 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
     
    Power Supply
    1x 1600W Redundant Titanium Level power supply
    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    +12V:
    Max: 83.3A / Min: 0A (100Vac-127Vac)
    Max: 133A / Min: 0A (200Vac-240Vac)

    12V SB:
    Max: 2.1A / Min: 0A

    AC Input:
    1000W: 100-127Vac / 50-60Hz
    1600W: 200-240Vac / 50-60Hz

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    LAN:
    1 RJ45 1 GbE Dedicated IPMI LAN port(s)

    USB:
    2 USB 3.0 port(s) (rear)

    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    4 Heavy Duty 8cm Fan(s)
     
    Operating Environment
    ROHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (Non-Condensing)
    Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
     
    Details
    Management
    Software:
    SuperCloud Composer
    Supermicro Server Manager (SSM)
    Supermicro Update Manager (SUM)
    SuperDoctor® 5
    Super Diagnostics Offline
    TAS: Supermicro Thin-Agent Service (TAS)
    SAA(new!)
    Power configurations:
    Power-on mode for AC power recovery
    ACPI Power Management

    Security
    Hardware:
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features:
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    Supply Chain Security: Remote Attestation
    Runtime BMC Protections
    System Lockdown

    PC Health Monitoring
    CPU:
    Monitors for CPU Cores, Chipset Voltages, Memory
    4+1 Phase-switching voltage regulator
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • ASG-2015S-E1CR24L
    ASG-2015S-E1CR24L
    Please Inquire
    SKU
    ASG-2015S-E1CR24L 
    Processor
    CPU:
    Single Socket SP5
    AMD EPYC™ 9004 Series Processors

    Core Count:
    Up to 84C/168T; Up to 384MB Cache

    Note:
    Supports 200W - 290W TDP CPUs (Air Cooled)
     
    Memory
    Memory:
    Slot Count: 12 DIMM slots
    Max Memory (2DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5"
    Width:
    17.2"
    Depth:
    34"
     
    Front Panel
    LED:
    Network activity
    Power status
    SSD activity
    System information (overheat/UID) 

    Buttons:
    Power On/Off 
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    System on Chip

    Network Connectivity:
    Via AIOM

    NVMe
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 26 bay(s)
    12 front hot-swap 3.5" SAS/SATA drive bay(s)
    12 top-loading hot-swap 3.5" SAS/SATA drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)
    Option A: Total 28 bay(s)
    12 front hot-swap 3.5" SAS/SATA drive bay(s)
    12 top-loading hot-swap 3.5" SAS/SATA drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)
    2 rear hot-swap 2.5" NVMe drive bay(s)
    Option B: Total 30 bay(s)
    12 front hot-swap 3.5" SAS/SATA drive bay(s)
    12 top-loading hot-swap 3.5" SAS/SATA drive bay(s)
    4 rear hot-swap 2.5" NVMe drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)

    M.2:
    2 M.2 NVMe slot(s) (M-key 2280/22110)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    5 PCIe 5.0 x16 FHHL slot(s)
    1 PCIe 5.0 x8 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option A
    3 PCIe 5.0 x16 FHHL slot(s)
    1 PCIe 5.0 x8 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option B
    2 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
     
    Power Supply
    1x 1600W Redundant Titanium Level power supply
    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    +12V:
    Max: 83.3A / Min: 0A (100Vac-127Vac)
    Max: 133A / Min: 0A (200Vac-240Vac)

    12V SB:
    Max: 2.1A / Min: 0A

    AC Input:
    1000W: 100-127Vac / 50-60Hz
    1600W: 200-240Vac / 50-60Hz

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    LAN:
    1 RJ45 1 GbE Dedicated IPMI LAN port(s)

    USB:
    2 USB 3.0 port(s) (rear)

    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    4 Heavy Duty 8cm Fan(s)
     
    Operating Environment
    ROHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (Non-Condensing)
    Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
     
    Details
    Management
    Software:
    SuperCloud Composer
    Supermicro Server Manager (SSM)
    Supermicro Update Manager (SUM)
    SuperDoctor® 5
    Super Diagnostics Offline
    TAS: Supermicro Thin-Agent Service (TAS)
    SAA(new!)
    Power configurations:
    Power-on mode for AC power recovery
    ACPI Power Management

    Security
    Hardware:
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features:
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    Supply Chain Security: Remote Attestation
    Runtime BMC Protections
    System Lockdown

    PC Health Monitoring
    CPU:
    Monitors for CPU Cores, Chipset Voltages, Memory
    4+1 Phase-switching voltage regulator
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • ASG-2115S-NE332R
    ASG-2115S-NE332R
    Please Inquire
    SKU
    ASG-2115S-NE332R 
    Processor
    CPU:
    Single Socket SP5
    AMD EPYC™ 9004 Series Processors

    Note:
    Supports 200W - 360W TDP CPUs (Air Cooled)
     
    Memory
    Memory:
    Slot Count: 24 DIMM slots
    Max Memory (1DPC): Up to 4TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
    Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (89.8 mm)
    Width:
    17.2" (438.4 mm)
    Depth:
    30.8" (789.9 mm)
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    AMD System on Chip

    Network Connectivity:
    Via AIOM
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 34 bay(s)
    32 front hot-swap E3.S 1T NVMe drive bay(s)
    2 rear hot-swap 2.5" SATA drive bay(s)

    M.2:
    2 M.2 NVMe slot(s) (M-key 2280/22110)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    2 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

    M.2:
    2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110)
     
    Power Supply
    1x 2000W Redundant Titanium Level power supply
    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    +12V:
    Max: 166A / Min: 0A (230Vac-240Vac)

    12V SB:
    Max: 3.5A

    AC Input:
    2000W: 230-240Vdc / 50-60Hz (for China only)

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    LAN:
    1 RJ45 1 GbE Dedicated IPMI LAN port(s)

    USB:
    2 USB 3.0 port(s) (rear)
    2 USB 3.0 port(s) (front)

    Video:
    1 VGA port(s)
     
    Cooling
    4 Heavy Duty 8cm Fan(s)
     
    Operating Environment
    ROHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (Non-Condensing)
    Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
     
  • SSG-221E-NE324R
    SSG-221E-NE324R
    Please Inquire
    SKU
    SSG-221E-NE324R 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Note:
    Supports 145W - 350W TDP CPUs (Air Cooled)
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    2U Rackmount Chassis
     
    Dimensions
    Height:
    3.5" (89.8 mm)
    Width:
    17.2" (438.4 mm)
    Depth:
    30.8" (789.9 mm)
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    Via AIOM

    NVMe
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 24 bay(s)
    24 front hot-swap E3.S 1T NVMe drive bay(s)

    M.2:
    2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    4 PCIe 5.0 x8 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option A
    2 PCIe 5.0 x8 FHHL slot(s)
    1 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    Option B
    2 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
     
    Power Supply
    1x 2000W Redundant Titanium Level power supply
    Dimension (WxHxL):
    73.5 x 40 x 203 mm

    +12V:
    Max: 166A / Min: 0A (230Vac-240Vac)

    12V SB:
    Max: 3.5A

    AC Input:
    2000W: 230-240Vdc / 50-60Hz (for China only)

    Output Type:
    Backplanes (gold finger)
     
    Cooling
    4 Heavy Duty 8cm Fan(s)
     
    Operating Environment
    ROHS:
    RoHS Compliant

    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (Non-Condensing)
    Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
     
  • SYS-421GE-TNHR2-LCC
    SYS-421GE-TNHR2-LCC
    $340,044.00
    SKU
    SYS-421GE-TNHR2-LCC 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
    Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)​

    Core Count:
    64C/128T; 320MB Cache per CPU

    Note:
    Supports up to 385W TDP CPUs (Liquid Cooled)​

    GPU
    Max GPU Count:

    Up to 8 onboard GPUs

    Supported GPU:
    NVIDIA SXM: HGX H100 8-GPU (80GB), HGX H200 8-GPU (141GB)

    CPU-GPU Interconnect:
    PCIe 5.0 x16 CPU-to-GPU Interconnect

    GPU-GPU Interconnect:
    NVIDIA® NVLink® with NVSwitch™

    Certification:
    Nvidia Certified
     
    Memory
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): 4TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): 8TB 4400MT/s ECC DDR5 RDIMM
     
    Chassis
    4U Rackmount Chassis
     
    Dimensions
    Height:
    6.85" (174 mm)
    Width:
    17.7" (449 mm)
    Depth:
    33.2" (842 mm)
     
    Front Panel
    Buttons:
    UID button
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    2 SFP28 25GbE with Broadcom® BCM57414 (optional)
    2 RJ45 10GbE with Intel® X710-AT2 (optional)
     
    HDD Drive Bays
    Drive Bays Configuration
    Default: 
    Total 8 bays
    8 front hot-swap 2.5" NVMe drive bays
     
    M.2:
    2 M.2 NVMe slots (M-key)
     
    Expansion Slots
    Default
    8 PCIe 5.0 x16 LP slots
    2 PCIe 5.0 x16 FHHL slots
    Option A
    8 PCIe 5.0 x16 LP slots
    4 PCIe 5.0 x16 FHHL slots
     
    Power Supply
    4x 5250W Redundant Titanium (certification pending) Level (96%) power supplies
    Dimension (WxHxL):

    106.5 x 82.1 x 245.3 mm

    AC Input:
    5250W: 200-240Vac / 50-60Hz

    +12V:
    Max: 125A / Min: 0A (200Vac-240Vac)

    Output Type:
    Backplanes (gold finger)

    Certification:
    Titanium (certification pending) Level
     
    Input Output
    Video:
    1 VGA port
     
    Cooling
    Fans:
    4 Fan 8cm Fan(s)

    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (non-condensing)
    Non-operating Relative Humidity: 5% to 95% (non-condensing)
     
    Details
    Management
    Software:
    SuperCloud Composer
    Supermicro Server Manager (SSM)
    Supermicro Update Manager (SUM)
    Supermicro SuperDoctor® 5 (SD5)
    Super Diagnostics Offline (SDO)
    Supermicro Thin-Agent Service (TAS)
    SuperServer Automation Assistant (SAA) New!
    Power configurations:
    Power-on mode for AC power recovery
    ACPI Power Management

    Security
    Hardware:
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features:
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    Supply Chain Security: Remote Attestation
    Runtime BMC Protections
    System Lockdown

    PC Health Monitoring
    CPU:
    Monitors for CPU Cores, Chipset Voltages, Memory
    8+4 Phase-switching voltage regulator
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • SYS-521GE-TNRT
    SYS-521GE-TNRT
    $120,956.00
    SKU
    SYS-521GE-TNRT 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 320MB Cache per CPU

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Supports up to 385W TDP CPUs (Liquid Cooled)​
     
    Max GPU Count:
    Up to 10 double-width or 10 single-width GPU(s)

    Supported GPU:
    NVIDIA PCIe: H100 NVL, H100, L40S, A100

    CPU-GPU Interconnect:
    PCIe 5.0 x16 Switch Dual-Root

    GPU-GPU Interconnect:
    NVIDIA® NVLink® Bridge (optional)
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    5U Rackmount Chassis
     
    Dimensions
    Height:
    8.75" (222.5mm)
    Width:
    17.2" (437mm)
    Depth:
    29" (737mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    System Reset button
    LEDs:
    Hard drive activity LED
    Network activity LEDs
    Power status LED
    System Overheat & Power Fail LED
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741
    Network Connectivity:
    2x 10GbE BaseT with Intel® X710-AT2
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    24x 2.5" hot-swap NVMe/SATA/SAS drive bays (8x 2.5" NVMe hybrid; 8x 2.5" NVMe dedicated)
     
    M.2:
    2 M.2 NVMe
     
    Expansion Slots
    12 PCIe 5.0 x16 FHFL slot(s)
    1 PCIe 5.0 X16 FHFL slot(s)
     
    Power Supply
    2700W Redundant Titanium Level power supplies
    Dimension (W x H x L):
    73.5 x 40 x 203 mm
    AC Input:
    2700W: 200-240Vac
    2700W: 200-240Vac / 50-60Hz
    2700W: 240-240Vdc / 50-60Hz (for CQC only)
    +12V:
    Max: 225A / Min: 0A (200Vac-240Vac)
    Max: 225A / Min: 0A (240Vdc-240Vdc)
    12V SB:
    Max: 3.5A / Min: 0A
    Max: 4A / Min: 0A
    Output Type:
    Backplanes (gold finger)
    Certification:
    Titanium Level
     
    Input Output
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    8 heavy duty fans with optimal fan speed control
    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
     
    Details
    Supported GPU:
    NVIDIA PCIe: H100, H100 NVL, L40S, L40, A100
    Intel® Data Center GPU
    CPU-GPU Interconnect:
    PCIe 5.0 x16 Switch Dual-Root
    GPU-GPU Interconnect:
    NVIDIA® NVLink™ Bridge (optional)
     
  • SYS-821GE-TNHR
    SYS-821GE-TNHR
    $409,228.00
    SKU
    SYS-821GE-TNHR 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 320MB Cache per CPU

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Supports up to 385W TDP CPUs (Liquid Cooled)​

    Max GPU Count:
    Up to 8 onboard GPU(s)

    Supported GPU:
    NVIDIA SXM: HGX H100 8-GPU (80GB)

    CPU-GPU Interconnect:
    PCIe 5.0 x16 CPU-to-GPU Interconnect

    GPU-GPU Interconnect:
    NVIDIA® NVLink® with NVSwitch™

    Certification:
    NVIDIA CERTIFIED
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    8U Rackmount Chassis
     
    Dimensions
    Height:
    14" (355.6 mm)
    Width:
    17.2" (437 mm)
    Depth:
    33.2" (843.28 mm)
     
    Front Panel
    LED:
    Hard drive activity LED
    Network activity LEDs
    Power status LED
    System Overheat & Power Fail LED

    Buttons:
    Power On/Off button
    System Reset button
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    2 RJ45 10GbE with Intel® X550-AT2 (optional)
    2 SFP28 25GbE with Broadcom® BCM57414 (optional)
    2 RJ45 10GbE with Intel® X710-AT2 (optional)

    NVMe
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 15 bay(s)
    12 front hot-swap 2.5" NVMe drive bay(s)
    3 front hot-swap 2.5" SATA drive bay(s)
    Option A: Total 19 bay(s)
    12 front hot-swap 2.5" NVMe drive bay(s)
    4 front hot-swap 2.5" NVMe drive bay(s)
    3 front hot-swap 2.5" SATA drive bay(s)
    (NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)

    M.2:
    2 M.2 NVMe slot(s) (M-key)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    8 PCIe 5.0 x16 LP slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    1x 3000W Redundant Titanium Level power supply
    Dimension (WxHxL):
    106.5 x 82.1 x 245.5 mm

    +12V:
    Max: 91.66A / Min: 0A (200Vac-240Vac)

    12V SB:
    Max: 3A / Min: 0A

    AC Input:
    3000W: 207-240Vac / 50-60Hz

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    10 heavy duty fans with optimal fan speed control

    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
Refine
Category
Manufacturer
Price Range
Keyword