8U - SuperMicro Dual Processor Server

Processor
CPU:
Dual processor(s)
AMD EPYC™ 9005 Series Processors
Core Count:
Up to 384C/768T
Note:
Supports up to 500W TDP CPUs (Air Cooled)

GPU
Max GPU Count:
8 onboard GPUs
Supported GPU:
NVIDIA SXM: HGX B300 8-GPU (288GB)
CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect:
NVIDIA® NVLink™ with NVSwitch™
Certification:
Nvidia Certified

Memory:
Slot Count: 24 DIMM slots
Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM
Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM

Memory Voltage:
1.1V

Buttons:
Power On/Off
UID

LED:
HDD activity
LAN1 activity
LAN2 activity
Power Fail
Power status
System information (overheat/UID)

Default: Total 8 bays

8x front hot-swap E1.S NVMe drive bays

 

2 M.2 NVMe slots (M-key)

QtyWithPsu:
6x 6600W

Description:
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies

Dimension (WxHxL):
106.5 x 82.1 x 245.3 mm

Input:
5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz

+12V:
Max: 130A / Min: 0A (200Vac-207.9Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)

12V SB:
Max: 4A / Min: 0A

Output Type:
Backplanes (gold finger)

Certification:
Titanium Level 94%+  Titanium Level

USB:
1x USB 3.0 Type-A port (Front)
1x USB 2.0 Type-A port (Front)

Video:
1x VGA port
1x mini-DP port

CPU:
Dual Socket SP5
AMD EPYC™ 9004 Series Processors

Core Count:
Up to 128C/256T

Note:
Supports up to 400W TDP CPUs (Air Cooled)

Max GPU Count:
Up to 8 onboard GPU(s)

Supported GPU:
NVIDIA SXM: HGX H100 8-GPU (80GB)

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink® with NVSwitch™

Memory:
Slot Count: 24 DIMM slots
Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Memory Voltage:
1.1V

LED:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Buttons:
Power On/Off button
System Reset button

Chipset:

AMD SP5

 

NVMe

 

Network Connectivity

Drive Bays Configuration:
Default: Total 18 bay(s)
2 front hot-swap 2.5" SATA drive bay(s)
4 front hot-swap 2.5" NVMe drive bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
(NVMe support may require additional storage controller and/or cables)

M.2:
1 M.2 NVMe slot(s) (M-key)

1x 3000W Redundant Titanium Level power supply
Dimension (WxHxL):
106.5 x 82.1 x 245.5 mm

+12V:
Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3A / Min: 0A

AC Input:
3000W: 207-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 385W TDP CPUs (Liquid Cooled)​

Max GPU Count:
Up to 8 onboard GPU(s)

Supported GPU:
NVIDIA SXM: HGX H100 8-GPU (80GB)

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink® with NVSwitch™

Certification:
NVIDIA CERTIFIED

Memory:
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Memory Voltage:
1.1V

LED:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Buttons:
Power On/Off button
System Reset button

Chipset:
Intel® C741

Network Connectivity:
2 RJ45 10GbE with Intel® X550-AT2 (optional)
2 SFP28 25GbE with Broadcom® BCM57414 (optional)
2 RJ45 10GbE with Intel® X710-AT2 (optional)

NVMe

Drive Bays Configuration:
Default: Total 15 bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
3 front hot-swap 2.5" SATA drive bay(s)
Option A: Total 19 bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
4 front hot-swap 2.5" NVMe drive bay(s)
3 front hot-swap 2.5" SATA drive bay(s)
(NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)

M.2:
2 M.2 NVMe slot(s) (M-key)

1x 3000W Redundant Titanium Level power supply
Dimension (WxHxL):
106.5 x 82.1 x 245.5 mm

+12V:
Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3A / Min: 0A

AC Input:
3000W: 207-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

CPU:
Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Core Count:
Up to 64C/128T; Up to 320MB Cache per CPU

Note:
Supports up to 350W TDP CPUs (Air Cooled)
Supports up to 385W TDP CPUs (Liquid Cooled)​

Max GPU Count:
Up to 8 onboard GPU(s)

Supported GPU:
NVIDIA SXM: HGX H100 8-GPU (80GB)

CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect:
NVIDIA® NVLink® with NVSwitch™

Certification:
NVIDIA CERTIFIED

Memory:
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Memory Voltage:
1.1V

LED:
Hard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED

Buttons:
Power On/Off button
System Reset button

Chipset:
Intel® C741

Network Connectivity:
2 RJ45 10GbE with Intel® X550-AT2 (optional)
2 SFP28 25GbE with Broadcom® BCM57414 (optional)
2 RJ45 10GbE with Intel® X710-AT2 (optional)

NVMe

Drive Bays Configuration:
Default: Total 15 bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
3 front hot-swap 2.5" SATA drive bay(s)
Option A: Total 19 bay(s)
12 front hot-swap 2.5" NVMe drive bay(s)
4 front hot-swap 2.5" NVMe drive bay(s)
3 front hot-swap 2.5" SATA drive bay(s)
(NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)

M.2:
2 M.2 NVMe slot(s) (M-key)

1x 3000W Redundant Titanium Level power supply
Dimension (WxHxL):
106.5 x 82.1 x 245.5 mm

+12V:
Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB:
Max: 3A / Min: 0A

AC Input:
3000W: 207-240Vac / 50-60Hz

Output Type:
Backplanes (gold finger)

Fans:
10 heavy duty fans with optimal fan speed control

Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)