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GPU Solutions

 
 
GPU technology can bring unprecedented performance to a broad spectrum of workloads
up to 5X, 10X, … 100X
improvements in performance and efficiency. These workloads span from the rapidly growing generative AI market to enterprise inferencing, product design, visualization, and to the intelligent edge. Supermicro has built a portfolio of workload-optimized systems for optimal GPU performance and efficiency across this broad spectrum of workloads.
 
 
Use Cases
 
• Large Language Models (LLMs)
• Autonomous Driving Training
• Recommender Systems
 
 
Opportunities and Challenges
 
• Continuous growth of data set size
• High performance everything: GPUs, memory, storage and network fabric
• Pool of GPU memory to fit large AI models and interconnect bandwidth for fast training
 

Key Technologies
 
• NVIDIA HGX H100 SXM 8-GPU/4-GPU
• GPU/GPU interconnect (NVLink and NVSwitch), up to 900GB/s – 7x greater than PCIe 5.0
• Dedicated high performance, high capacity GPU memory 
• High throughput networking and storage per GPU enabling NVIDIA GPUDirect RDMA and Storage.
 

Solution Stack
 
• DL Frameworks: TensorFlow, PyTorch
• Transformers: BERT, GPT, Vision Transformer
• NVIDIA AI Enterprise Frameworks (NVIDIA Nemo, Metropolis, Riva, Morpheus, Merlin
• NVIDIA Base Command (infrastructure software libraries, workload orchestration, cluster management)
• High performance storage (NVMe) for training cache
• Scale-out storage for raw data (data lake)
 
 

 
 
 
HGX H100 Systems
Multi-Architecture Flexibility with Future-Proof, Open-Standards-Based Design
 
 
 
Benefits & Advantages
 
• High performance GPU interconnect up to 900GB/s - 7x better performance than PCIe
• Superior thermal design supports maximum power/performance CPUs and GPUs
• Dedicated networking and storage per GPU with up to double the NVIDIA GPUDirect throughput of the previous generation
• Modular architecture for storage and I/O configuration flexibility with front and rear I/O options
 
 
 
Key Features
• 4 or 8 next-generation H100 SXM GPUs with NVLink, NVSwitch interconnect
• Dual 4th Gen Intel® Xeon® Scalable processors or AMD EPYC™ 9004 series processors
• Supports PCIe 5.0, DDR5 and Compute Express Link (CXL) 1.1+
• Innovative modular architecture designed for flexibility and futureproofing in 8U or 4U.
• Optimized thermal capacity and airflow to support CPUs up to 350W and GPUs up to 700W with air cooling and optional liquid cooling
• PCIe 5.0 x16 1:1 networking slots for GPUs up to 400Gbps each supporting GPUDirect Storage and RDMA and up to 16 U.2 NVMe drive bays
 
 

 
Medium
SYS-421GU-TNXR
 
• 4U 4-GPU
• NVIDIA HGX H100 SXM 4-GPU
• 6 U.2 NVMe Drives
• 8 PCIe 5.0 x16 networking slots
 

 
Large
SYS-821GE-TNHR / AS -8125GS-TNHR
 
• 8U 8-GPU
• NVIDIA HGX H100 SXM 8-GPU
• 16 U.2 NVMe Drives
• 8 PCIe 5.0 x16 networking slots
 
 
 
 
 
 
 
 
 
We offer the most appropriate GUP solutions for your business need. Call Now 1-800-5628650 or Click the "Quote Form" button to get a detail solution quote. 
 
 
 
  • ARS-111GL-DNHR-LCC
    ARS-111GL-DNHR-LCC
    $104,155.00
    SKU
    ARS-111GL-DNHR-LCC 
    Processor
    (per Node)
    CPU:
    NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
    Note:
    Supports up to 2000W TDP CPUs (Liquid Cooled)​
     
    GPU
    Max GPU Count:

    Up to 1 onboard GPU
    Supported GPU:
    NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
    View GPU Options
    CPU-GPU Interconnect:
    NVLink®-C2C
    GPU-GPU Interconnect:
    PCIe
     
    Memory
    Slot Count: Onboard Memory
    Max Memory: Up to 480GB ECC LPDDR5X
    Additional GPU Memory: Up to 96GB ECC HBM3
     
    Chassis
    1U Rackmount Chassis
     
    Dimensions
    Height:
    1.75" (44 mm)
    Width:
    17.33" (440 mm)
    Depth:
    37" (940 mm)
     
    Bios
    BIOS Type:
    AMI 64MB SPI Flash EEPROM
     
    HDD Drive Bays
    Default: 
    Total 4 bays
    4 front hot-swap E1.S NVMe drive bays

    M.2:
    2 M.2 NVMe slots (M-key)
     
    Expansion Slots
    Default
    2 PCIe 5.0 x16 FHFL slots
     
    Power Supply
    2x 2700W Redundant Titanium Level (96%) power supplies

    Dimension (WxHxL):
    73.5 x 40 x 185 mm

    Input:
    2700W: 200-240Vac / 50-60Hz
    2700W: 240-240Vdc / 50-60Hz (for CQC only)

    +12V:
    Max: 225A / Min: 0A (200Vac-240Vac)
    Max: 225A / Min: 0A (240Vdc-240Vdc)

    12V SB:
    Max: 4A / Min: 0A

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    (per Node)
    LAN:

    1 RJ45 1 GbE Dedicated BMC LAN port
    USB:
    2 ports(rear)
    Video:
    1 mini-DP port
     
    Cooling
    Fans:
    7 Removable heavy-duty 4cm Fan(s)
    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (non-condensing)
    Non-operating Relative Humidity: 5% to 95% (non-condensing)
     
    Details
    Management
    Power configurations:

    Power-on mode for AC power recovery
    ACPI Power Management

    PC Health Monitoring
    CPU:

    Monitors for CPU Cores, Chipset Voltages, Memory
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • ARS-111GL-NHR
    ARS-111GL-NHR
    $52,780.00
    SKU
    ARS-111GL-NHR 
    Processor
    CPU:
    NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
    Note:
    Supports up to 1000W TDP CPUs (Air Cooled)
     
    Memory
    Slot Count: Onboard Memory
    Max Memory: Up to 480GB ECC LPDDR5X
    Additional GPU Memory: Up to 96GB ECC HBM3
     
    Chassis
    1U Rackmount Chassis
     
    Dimensions
    Height:
    1.7" (43.6 mm)
    Width:
    17.26" (438.4 mm)
    Depth:
    35.4" (900 mm)
     
    Front Panel
    Buttons:
    Power On/Off button
     
    Bios
    BIOS Type:
    AMI 64MB SPI Flash EEPROM
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 8 bays
    8 front hot-swap E1.S NVMe drive bays

    M.2:
    2 M.2 NVMe slots (M-key)
     
    Expansion Slots
    Default
    2 PCIe 5.0 x16 FHFL slots
     
    Power Supply
    2x 2000W Redundant Titanium Level (96%) power supplies

    Dimension (WxHxL):
    73.5 x 40 x 185 mm

    Input:
    1000W: 100-127Vac / 50-60Hz
    1800W: 200-220Vac / 50-60Hz
    1980W: 220-230Vac / 50-60Hz
    2000W: 220-240Vac / 50-60Hz (for UL only)
    2000W: 230-240Vac / 50-60Hz
    2000W: 230-240Vdc / 50-60Hz (for CQC only)

    +12V:
    Max: 83A / Min: 0A (100Vac-127Vac)
    Max: 150A / Min: 0A (200Vac-220Vac)
    Max: 165A / Min: 0A (220Vac-230Vac)
    Max: 166A / Min: 0A (230Vac-240Vac)

    12V SB:
    Max: 3.5A / Min: 0A

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    LAN:
    1 RJ45 1 GbE Dedicated BMC LAN port

    USB:
    1 USB 3.0 port(Rear)

    Video:
    1 mini-DP port

    TPM:
    1 TPM Onboard/port 80
     
    Cooling
    Fans:
    9 Removable heavy-duty 4cm Fan(s)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (non-condensing)
    Non-operating Relative Humidity: 5% to 95% (non-condensing)
     
    Details
    Management
    Power configurations:

    Power-on mode for AC power recovery
    ACPI Power Management

    PC Health Monitoring
    CPU:

    Monitors for CPU Cores, Chipset Voltages, Memory
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • SYS-421GE-TNHR2-LCC
    SYS-421GE-TNHR2-LCC
    $340,044.00
    SKU
    SYS-421GE-TNHR2-LCC 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
    Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)​

    Core Count:
    64C/128T; 320MB Cache per CPU

    Note:
    Supports up to 385W TDP CPUs (Liquid Cooled)​

    GPU
    Max GPU Count:

    Up to 8 onboard GPUs

    Supported GPU:
    NVIDIA SXM: HGX H100 8-GPU (80GB), HGX H200 8-GPU (141GB)

    CPU-GPU Interconnect:
    PCIe 5.0 x16 CPU-to-GPU Interconnect

    GPU-GPU Interconnect:
    NVIDIA® NVLink® with NVSwitch™

    Certification:
    Nvidia Certified
     
    Memory
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): 4TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): 8TB 4400MT/s ECC DDR5 RDIMM
     
    Chassis
    4U Rackmount Chassis
     
    Dimensions
    Height:
    6.85" (174 mm)
    Width:
    17.7" (449 mm)
    Depth:
    33.2" (842 mm)
     
    Front Panel
    Buttons:
    UID button
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    2 SFP28 25GbE with Broadcom® BCM57414 (optional)
    2 RJ45 10GbE with Intel® X710-AT2 (optional)
     
    HDD Drive Bays
    Drive Bays Configuration
    Default: 
    Total 8 bays
    8 front hot-swap 2.5" NVMe drive bays
     
    M.2:
    2 M.2 NVMe slots (M-key)
     
    Expansion Slots
    Default
    8 PCIe 5.0 x16 LP slots
    2 PCIe 5.0 x16 FHHL slots
    Option A
    8 PCIe 5.0 x16 LP slots
    4 PCIe 5.0 x16 FHHL slots
     
    Power Supply
    4x 5250W Redundant Titanium (certification pending) Level (96%) power supplies
    Dimension (WxHxL):

    106.5 x 82.1 x 245.3 mm

    AC Input:
    5250W: 200-240Vac / 50-60Hz

    +12V:
    Max: 125A / Min: 0A (200Vac-240Vac)

    Output Type:
    Backplanes (gold finger)

    Certification:
    Titanium (certification pending) Level
     
    Input Output
    Video:
    1 VGA port
     
    Cooling
    Fans:
    4 Fan 8cm Fan(s)

    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity: 8% to 90% (non-condensing)
    Non-operating Relative Humidity: 5% to 95% (non-condensing)
     
    Details
    Management
    Software:
    SuperCloud Composer
    Supermicro Server Manager (SSM)
    Supermicro Update Manager (SUM)
    Supermicro SuperDoctor® 5 (SD5)
    Super Diagnostics Offline (SDO)
    Supermicro Thin-Agent Service (TAS)
    SuperServer Automation Assistant (SAA) New!
    Power configurations:
    Power-on mode for AC power recovery
    ACPI Power Management

    Security
    Hardware:
    Trusted Platform Module (TPM) 2.0
    Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features:
    Cryptographically Signed Firmware
    Secure Boot
    Secure Firmware Updates
    Automatic Firmware Recovery
    Supply Chain Security: Remote Attestation
    Runtime BMC Protections
    System Lockdown

    PC Health Monitoring
    CPU:
    Monitors for CPU Cores, Chipset Voltages, Memory
    8+4 Phase-switching voltage regulator
    FAN:
    Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature:
    Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
     
  • SYS-421GE-TNRT
    SYS-421GE-TNRT
    $118,955.00
    SKU
    SYS-421GE-TNRT 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 320MB Cache per CPU

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Supports up to 385W TDP CPUs (Liquid Cooled)​

    Max GPU Count:
    Up to 10 double-width or 10 single-width GPU(s)

    Supported GPU:
    NVIDIA PCIe: H100, L40, RTX A4000, RTX 6000 ADA, L40S, A100, A10
    Intel PCIe: Data Center GPU Max 1100

    CPU-GPU Interconnect:
    PCIe 5.0 x16 Switch Dual-Root

    GPU-GPU Interconnect:
    NVIDIA® NVLink® Bridge (optional), Intel® Xe Link Bridges
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): Up to 4TB 5600MT/s ECC RDIMM
    Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1 V
     
    Chassis
    4U Rackmount Chassis
     
    Dimensions
    Height:
    7" (178mm)
    Width:
    17.2" (437mm)
    Depth:
    29" (737mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    System Reset button

    LEDs:
    Hard drive activity LED
    Network activity LEDs
    Power status LED
    System Overheat & Power Fail LED
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    2x 10GbE BaseT with Intel® X710-AT2

    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    24x 2.5" hot-swap NVMe/SATA/SAS drive bays (8x 2.5" NVMe hybrid; 8x 2.5" NVMe dedicated)

    M.2:
    2 M.2 NVMe
     
    Expansion Slots
    12 PCIe 5.0 x16 LP slot(s)
    1 PCIe 5.0 X16 slot(s)
     
    Power Supply
    2700W, Titanium efficiency, Redundant w/PMBus power supply, W73.5xH39/40xL203 mm, C20 inlet
    Dimension (W x H x L):

    73.5 x 40 x 203 mm

    AC Input:
    2700W: 200-240Vac / 50-60Hz

    +12V:
    Max: 225A / Min: 0A (200Vac-240Vac)

    12V SB:
    Max: 3.5A / Min: 0A

    Output Type:
    25 Pairs Gold Finger Connector

    Certification:
    Titanium Level
     
    Input Output
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    8 heavy duty fans with optimal fan speed control

    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
     
    Details
    Management
    Software:
    OOB Management Package (SFT-OOB-LIC )
    Redfish API
    IPMI 2.0
    SSM
    Intel® Node Manager
    SPM
    KVM with dedicated LAN
    SUM
    NMI
    Watch Dog
    SuperDoctor® 5
    Power Configurations:
    ACPI Power Management
    Power-on mode for AC power recovery
     
  • SYS-521GE-TNRT
    SYS-521GE-TNRT
    $120,956.00
    SKU
    SYS-521GE-TNRT 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 320MB Cache per CPU

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Supports up to 385W TDP CPUs (Liquid Cooled)​
     
    Max GPU Count:
    Up to 10 double-width or 10 single-width GPU(s)

    Supported GPU:
    NVIDIA PCIe: H100 NVL, H100, L40S, A100

    CPU-GPU Interconnect:
    PCIe 5.0 x16 Switch Dual-Root

    GPU-GPU Interconnect:
    NVIDIA® NVLink® Bridge (optional)
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    5U Rackmount Chassis
     
    Dimensions
    Height:
    8.75" (222.5mm)
    Width:
    17.2" (437mm)
    Depth:
    29" (737mm)
     
    Front Panel
    Buttons:
    Power On/Off button
    System Reset button
    LEDs:
    Hard drive activity LED
    Network activity LEDs
    Power status LED
    System Overheat & Power Fail LED
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741
    Network Connectivity:
    2x 10GbE BaseT with Intel® X710-AT2
    IPMI:
    Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
     
    HDD Drive Bays
    Hot-swap:
    24x 2.5" hot-swap NVMe/SATA/SAS drive bays (8x 2.5" NVMe hybrid; 8x 2.5" NVMe dedicated)
     
    M.2:
    2 M.2 NVMe
     
    Expansion Slots
    12 PCIe 5.0 x16 FHFL slot(s)
    1 PCIe 5.0 X16 FHFL slot(s)
     
    Power Supply
    2700W Redundant Titanium Level power supplies
    Dimension (W x H x L):
    73.5 x 40 x 203 mm
    AC Input:
    2700W: 200-240Vac
    2700W: 200-240Vac / 50-60Hz
    2700W: 240-240Vdc / 50-60Hz (for CQC only)
    +12V:
    Max: 225A / Min: 0A (200Vac-240Vac)
    Max: 225A / Min: 0A (240Vdc-240Vdc)
    12V SB:
    Max: 3.5A / Min: 0A
    Max: 4A / Min: 0A
    Output Type:
    Backplanes (gold finger)
    Certification:
    Titanium Level
     
    Input Output
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    8 heavy duty fans with optimal fan speed control
    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
    Operating Environment
    Environmental Spec.:
    Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
    Operating Relative Humidity:
       8% to 90% (non-condensing)
    Non-operating Relative Humidity:
       5% to 95% (non-condensing)
     
    Details
    Supported GPU:
    NVIDIA PCIe: H100, H100 NVL, L40S, L40, A100
    Intel® Data Center GPU
    CPU-GPU Interconnect:
    PCIe 5.0 x16 Switch Dual-Root
    GPU-GPU Interconnect:
    NVIDIA® NVLink™ Bridge (optional)
     
  • SYS-821GE-TNHR
    SYS-821GE-TNHR
    $409,228.00
    SKU
    SYS-821GE-TNHR 
    Processor
    CPU:
    Dual Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

    Core Count:
    Up to 64C/128T; Up to 320MB Cache per CPU

    Note:
    Supports up to 350W TDP CPUs (Air Cooled)
    Supports up to 385W TDP CPUs (Liquid Cooled)​

    Max GPU Count:
    Up to 8 onboard GPU(s)

    Supported GPU:
    NVIDIA SXM: HGX H100 8-GPU (80GB)

    CPU-GPU Interconnect:
    PCIe 5.0 x16 CPU-to-GPU Interconnect

    GPU-GPU Interconnect:
    NVIDIA® NVLink® with NVSwitch™

    Certification:
    NVIDIA CERTIFIED
     
    Memory
    Memory:
    Slot Count: 32 DIMM slots
    Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

    Memory Voltage:
    1.1V
     
    Chassis
    8U Rackmount Chassis
     
    Dimensions
    Height:
    14" (355.6 mm)
    Width:
    17.2" (437 mm)
    Depth:
    33.2" (843.28 mm)
     
    Front Panel
    LED:
    Hard drive activity LED
    Network activity LEDs
    Power status LED
    System Overheat & Power Fail LED

    Buttons:
    Power On/Off button
    System Reset button
     
    Bios
    BIOS Type:
    AMI 32MB SPI Flash EEPROM
     
    Onboard Devices
    Chipset:
    Intel® C741

    Network Connectivity:
    2 RJ45 10GbE with Intel® X550-AT2 (optional)
    2 SFP28 25GbE with Broadcom® BCM57414 (optional)
    2 RJ45 10GbE with Intel® X710-AT2 (optional)

    NVMe
     
    HDD Drive Bays
    Drive Bays Configuration:
    Default: Total 15 bay(s)
    12 front hot-swap 2.5" NVMe drive bay(s)
    3 front hot-swap 2.5" SATA drive bay(s)
    Option A: Total 19 bay(s)
    12 front hot-swap 2.5" NVMe drive bay(s)
    4 front hot-swap 2.5" NVMe drive bay(s)
    3 front hot-swap 2.5" SATA drive bay(s)
    (NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)

    M.2:
    2 M.2 NVMe slot(s) (M-key)
     
    Expansion Slots
    PCI-Express (PCIe) Configuration:
    Default
    8 PCIe 5.0 x16 LP slot(s)
    2 PCIe 5.0 x16 FHHL slot(s)
     
    Power Supply
    1x 3000W Redundant Titanium Level power supply
    Dimension (WxHxL):
    106.5 x 82.1 x 245.5 mm

    +12V:
    Max: 91.66A / Min: 0A (200Vac-240Vac)

    12V SB:
    Max: 3A / Min: 0A

    AC Input:
    3000W: 207-240Vac / 50-60Hz

    Output Type:
    Backplanes (gold finger)
     
    Input Output
    Video:
    1 VGA port(s)
     
    Cooling
    Fans:
    10 heavy duty fans with optimal fan speed control

    Liquid Cooling:
    Direct to Chip (D2C) Cold Plate (optional)
     
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