6U - AMD Servers

B683-Z80-AAS1

Please Inquire

SKU	B683-Z80-AAS1

Processor

CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor per node, TDP up to 500W

Note:
If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket
20x LGA 6096
Socket SP5

Memory

24x DIMM slots per node
Support DDR5 RDIMM
12-Channel memory per processor

AMD EPYC™ 9005:
Up to 6400 MT/s

AMD EPYC™ 9004:
Up to 4800 MT/s

Chassis

6U Chassis

Dimensions

WxHxD

447mm x 262.3mm x 900mm

Onboard Devices

LAN
Front:
1x 10/100/1000 Mbps Management LAN per node

Rear (MLAN board):
2x Chassis Management LAN

Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video
Integrated in ASPEED® AST2600
1x Mini-DP per node

HDD Drive Bays

Front hot-swap:
2x E3.S Gen5 NVMe per node, from CPU_0

Expansion Slots

Riser Card x 2:
1x LP x16 (Gen5 x16) per node, from CPU_0
1x LP x16 (Gen5 x16) per node, from CPU_1

Power Supply

10 x 3200W 80 PLUS Titanium redundant power supplies

AC Input:
100-127V~/ 16A, 50-60Hz
200-220V~/ 16A, 50-60Hz
220-240V~/ 16A, 50-60Hz

DC Input: (Only for China)
240Vdc/ 16A

DC Output:
Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A

Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A

Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A

Note:
The system power supply requires C19 power cord.

Input Output

Front I/O
Per node:
2x USB 3.2 Gen1 ports (Type-A)
1x Mini-DP
1x MLAN port
1x Power button with LED
1x System status LED
1x ID LED

Rear I/O
MLAN board:
2x CMC ports
1x CMC status LED

Cooling

System Fans
10x 80x80x80mm

Operating Environment

Operating temperature: 10°C to 25°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

B684-A80-AAS1

Please Inquire

CONFIGURE

SKU	B684-A80-AAS1

Processor

CPU

Intel® Xeon® 6+ Processors
Intel® Xeon® 6900E+ Processors

Intel® Xeon® 6 Processors
Intel® Xeon® 6900-Series Processors

Dual processors per node, TDP up to 500 W

Note:
If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket
20x LGA 7529
Socket BR

Memory

24x DIMM slots per node
Support DDR5 RDIMM/MRDIMM
12-Channel memory per processor

Intel Xeon 6900E+:
RDIMM: Up to 8000 MT/s

Intel Xeon 6900-series:
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s

Note:
MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores.

Chassis

6U Chassis

Dimensions

WxHxD
447mm x 262.3mm x 900mm

Onboard Devices

LAN
Front:
1x 10/100/1000 Mb/s Management LAN per node

Rear (MLAN board):
2x Chassis Management LAN

Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video
Integrated in ASPEED® AST2600
1x Mini-DP per node

HDD Drive Bays

Front hot-swap:
2x E3.S Gen5 NVMe per node, from CPU_0

Expansion Slots

Riser Card x 3:
2x LP x16 (Gen5 x16) per node, from CPU_0
1x LP x16 (Gen5 x16) per node, from CPU_1

Note：
Supports ambient temperatures up to 25°C with all three PCIe slots occupied.

Power Supply

7+3 3200 W 80 PLUS Titanium redundant power supplies

AC Input:
100-127V~/ 16A, 50-60Hz
200-220V~/ 16A, 50-60Hz
220-240V~/ 16A, 50-60Hz

DC Input: (Only for China)
240Vdc/ 16A

DC Output:
Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A

Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A

Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A

Note：
The system power supply requires C19 power cord.

Input Output

Front I/O
Per node:
2x USB 3.2 Gen1 ports (Type-A)
1x Mini-DP
1x MLAN port
1x Power button with LED
1x System status LED
1x ID LED

Rear I/O
MLAN board:
2x CMC ports
1x CMC status LED

Cooling

System Fans
10x 80x80x80mm

Operating Environment

Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

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